DMTS, NAND PI
Core
Lead process modules to design, develop, integrate, and implement innovative solutions for next-generation 3D NAND product yield, quality, and performance.
Role type
Distinguished Member of Technical Staff (Process Integration)
Builds
Next-generation 3D NAND semiconductor integrated circuits
Domain
Semiconductor manufacturing / Non-volatile memory
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Process integration, structural development, electrical performance optimization, parametric verification, material analysis, experimental design, team leadership, technology transfer, patent generation, multi-functional coordination
Preferred skills
Scripting/programming (Python, SolidWorks, Tableau, Power BI), deep understanding of NAND process flow and fail mechanisms, R&D experience
Technologies
Python, SolidWorks, Tableau, Power BI
Responsibilities
Define structural specifications and process requirements; set strategic direction and improvement plans; proactively identify and resolve structure, electrical, and reliability issues; optimize manufacturability and process control; analyze materials and drive new material selection; design and implement device/process experiments; lead development teams and set goals; innovate to address complex problems and generate IP; coordinate cross-functional activities for rapid project execution; transfer new technology to high-volume manufacturing.
Seniority
Distinguished Member of Technical Staff (Senior, hands-on IC with leadership)