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Principal Node Development Product Engineer, DPAG

Boise, ID - Main Site💼 Full-time🗓 2026-05-12 → 2026-07-30

Core

Drive product readiness for next-generation DRAM by translating silicon behavior into actionable decisions across process, design, and manufacturing teams.

Role type

Principal Node Development Product Engineer (Semiconductor)

Builds

Next-generation DRAM memory and storage solutions

Domain

Semiconductor manufacturing and DRAM technology development

Deliverable

production ML models | product features | infrastructure

Required skills

Semiconductor process integration, device physics, silicon data analysis, yield engineering, cross-functional problem solving, test content strategy, PPA/yield/reliability assessment

Preferred skills

DRAM process technology scaling, node development, failure mechanism analysis (implants, lithography, etch), technology bring-up and HVM ramp, Python/data scripting

Technologies

Lab tools, testers, Python

Responsibilities

Drive process-aware product optimization and identify integration risks; Analyze electrical, parametric, and yield data to find systematic limiters; Partner with design, process, and test teams to debug yield issues; Enable node readiness and factory ramp; Translate process changes into product impact assessments; Guide test monitoring strategies; Provide technical leadership and mentorship.

Seniority

Principal, hands-on IC with strategic influence

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