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New College Grad - Process Integration Engineer

Boise, Idaho, United States of America💼 Full-time🗓 2026-09-10 → 2026-09-25

Core

Optimize semiconductor processes to improve yield, reduce costs, and enable next-generation memory devices through root cause analysis, DOE, and technology transfer.

Role type

Entry-level Process Integration Engineer (Semiconductor Manufacturing)

Builds

Advanced semiconductor memory devices (DRAM, NAND) and process tools

Domain

Semiconductor manufacturing / Memory technology

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Root cause investigation, Failure analysis, Design of Experiments (DOE), Statistical Process Control (SPC), Fault Detection and Classification (FDC), Yield management, Process optimization, Material supplier management, Technology transfer, FMEA, 8D problem solving, JMP software proficiency

Preferred skills

Master's or Ph.D. in relevant field, 300mm semiconductor environment internship, Transistor and metallization process knowledge, Yield ramp experience, Agentic AI familiarity

Technologies

JMP, SPC/FDC/RMS/APC systems, 300mm semiconductor tools

Responsibilities

Conduct root cause investigations and failure analysis; Drive yield and cost efficiency improvements; Run Design of Experiments (DOE); Monitor trends and sustain line stability; Lead workshops during technology transfer; Validate and qualify new processes and materials; Manage and audit material suppliers; Support internal and external audits.

Seniority

Entry-level, New College Grad

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