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Hardware & Physical Engineering
› Analog IC Design
Analog IC Design
1,390 open positions
New College Grad - IC Package Layout Engineer
Micron
Boise, ID - Main Site
17d
Design and verify layouts for advanced semiconductor packages (DDR, LPDDR, GDDR, NAND, ASIC) used in memory and storage products.
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Analog IC Design Engineer, Intern
Marvell
Pavia, Italy
$21k–$29k
17d
Design integrated circuits for electrical and electro-optical interfaces at 100+ Gb/s using advanced technology nodes (3nm FinFET and 2nm GAAFET) for AI and Cloud data center applications.
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Summer 2027 Internships - Design Engineering
Silabs
Austin
17d
Summer 2027 internship for early-career students to work on semiconductor design projects including analog/mixed-signal, digital, verification, physical design, RF, or design automation.
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設計検証エンジニア/ Design Verification Engineer
Micron
Hashimoto, Japan
17d
Design and verify digital and analog circuits for memory products, supporting silicon-to-systems solutions from technology development to product validation.
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Analog Layout Engineer
Accenture
Bengaluru
17d
Design the physical layout of analog circuits, ensuring proper component placement and routing for optimal performance while addressing parasitic effects, signal integrity, and power distribution.
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ENGR PRIN, DESIGN LAYOUT; DSGN
ON Semiconductor
Bangalore, Karnataka, India
17d
Lead physical layout implementation of complex analog and mixed-signal blocks including ADCs, PLLs, Bandgaps, References, LDOs, Bias circuits, and image sensor-related analog IPs.
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Staff Analog Design Engineer
ON Semiconductor
Bangalore, Karnataka, India
17d
Drive development of state-of-the-art analog blocks and mixed signal CMOS designs reusable across market segments, pushing performance, power, and reliability limits.
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System Engineer | Audio
Texas Instruments
Dallas, TX, United States
17d
Define product strategies, drive design wins, and support system-level IC applications across automotive, industrial, consumer, and computing markets.
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2027 New College Graduates - Design Engineering
Silabs
Austin
17d
Early-career talent pool for Design Engineering teams focusing on semiconductor product design, verification, and implementation.
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(Senior) Development Engineer- Protection & Filtering (m/w/d)
Hamburg, HAMBURG
17d
Develop next-generation discrete ESD and TVS protection devices for high-speed, RF sensitive and automotive applications, acting as a system architect for product performance and technical concept definition.
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Sr. Mixed Signal ASIC Systems Engineer
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Sitime Corporation
Ottawa, ON, CA
$96k–$132k
17d
First-line systems engineer for new MEMS timing ASIC devices, ensuring they meet specifications and function within larger systems before customer release.
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Analog ASIC Electrical Engineer - 966
Quantinuum
US Broomfield, CO
17d
Lead the development of ASIC designs for Apollo and Lumos quantum computers, focusing on analog CMOS circuit design and integration with complex electrical systems.
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Director Engineering, Analog Design (Power ICs) - Chip Lead
Renesas-Electronics
Bengaluru, KA, in
18d
Define optimum system architecture for application-specific ICs serving India market requirements across automotive, industrial, power, and mixed-signal applications.
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Mixed-Signal CMOS Design Engineer
Flir
US - Camarillo, CA
$91k–$91k
18d
Design and develop mixed-signal CMOS integrated circuits and readout integrated circuits for next-generation infrared imaging sensors.
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Advanced Packaging Intern, BS - Summer 2027
Marvell
Burlington, VT
$64k–$129k
18d
Intern supporting customers with advanced package designs meeting challenging electrical requirements for high-speed signaling and power delivery.
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Package Design Engineer
Broadcom
USA-CA San Jose Innovation Drive
$83k–$83k
18d
IC package-design engineer for complex flip-chip-BGA packages enabling high-speed SerDes and very-high-power delivery for AI, networking, HPC, and 5G base stations.
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R&D Engineer
Lumentum
Remote - Israel
18d
Design, test, and characterize optical transceivers and high-speed communication modules for data-center and AI network architectures.
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BCD Technologist
Texas Instruments
Dallas, TX, United States
18d
Lead the development and integration of next-generation Bipolar-CMOS-DMOS (BCD) technologies for analog and power products.
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Staff Systems Design Engineer
Analogdevices
US, CA, San Jose, Rio Robles
$151k–$151k
18d
Drive next-generation mixed-signal IC products from concept through production silicon, working across analog, digital, firmware, and system architecture.
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Associate Analog Design Engineer
Analogdevices
Philippines, Cavite (jp)
18d
Design and development of analog and mixed-signal integrated circuits including sensor interfaces, data converters, and power distribution systems.
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Memory Circuit Design Engineer - TCAM/SRAM
Cisco
Zhubei, Taiwan
18d
Design, develop, and test TCAM and SRAM memory circuits for electronic systems, ensuring performance, reliability, and safety standards.
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IC Design Engineer
Manatal Test account
Milton, Queensland
19d
Design and develop integrated circuits for consumer electronics, automotive, and industrial products.
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Design Engineer
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Arm
KA, IN
19d
Develop and optimize Arm custom standard cells for advanced sub-3nm process technologies to improve power, performance, and area (PPA) of SoCs.
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Analog IC Design Engineer
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Tetramem Singapore Pte. Ltd.
Singapore, S00, SG
19d
Design and development of high-performance analog integrated circuits including amplifiers, data converters, and voltage regulators.
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Silicon Photonics PIC Design & Process Engineer
↗
Clementi, S00, SG
19d
Physical implementation and manufacturability of silicon photonic integrated circuits (PICs), bridging design and semiconductor manufacturing for AI data center infrastructure.
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Research Fellow (IC Design and academic)
Ntu
NTU Main Campus, Singapore
19d
Design and realize high speed high efficiency analog/RF ICs, specifically RF power management ICs, while supporting teaching activities.
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Senior Engineer Analog Mixed-Signal Design (f/m/div)
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Infineon Technologies
Villach, K, AT
$47k–$47k
19d
Design analog/mixed-signal blocks and ensure top-level functionality for semiconductor solutions in power systems and IoT.
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Silicon Photonics Chip & System Architecture Engineer
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Clementi, S00, SG
19d
Define system-level architecture for next-generation high-speed silicon photonics solutions (800G, 1.6T, 3.2T), translating requirements into chip-level optical and electrical specifications.
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Senior Layout Designer
Micron
Hyderabad - Phoenix Aquila, India
19d
Designing high-quality analog and mixed-signal layouts for critical blocks including sensors, PLLs, ADCs, and digital arrays.
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Principal Engineer , Memory Design
Micron
Hyderabad - Phoenix Aquila, India
19d
Lead the design, layout, and optimization of DRAM memory arrays, peripheral logic, and analog circuits, leveraging AI-based tools for automation and verification.
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Senior Design Engineer
Micron
Hyderabad - Phoenix Aquila, India
19d
Lead the design, layout, and optimization of Memory/Logic/Analog circuits for new DRAM and emerging memory products.
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Senior/ Staff/ Principal - Silicon Design Validation Engineer
Micron
Hyderabad - Phoenix Aquila, India
19d
Develop, validate, characterize, and qualify new NAND Flash memory products through silicon design validation.
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Engineer (Semicon, One North)
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Persol
Singapore, S00, SG
$8k–$8k
19d
Custom Layout Engineer supporting physical implementation of Foundation IP, Analog IP, and RFIC designs across advanced semiconductor process technologies.
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Entry Level Digital Physical Design Engineer
Nxp
Austin (Oakhill, Office)
19d
Entry-level engineer supporting physical design activities including layout implementation, rule checks, and design data preparation for semiconductor products.
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Analog Circuit Design Engineer
Intel
India, Bangalore
19d
Design, develop, and build analog circuits in advanced process nodes for analog and mixed-signal IPs, optimizing for power, performance, area, timing, and yield.
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IC Digital Design Intern
Sonyglobal
Lysaker
19d
Design and development of advanced CMOS image sensors, specifically timing/control signals for pixel array readout, amplifiers, ADCs, signal processing blocks, I/O interfaces, and low noise power supplies.
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PRINCIPAL R&D/PRODUCT DVL ENGINEER
Te-Connectivity
USA
20d
Lead end-to-end product development of high-speed, fine-pitch, large-size sockets for digital data networks, focusing on concept development, design validation, and customer collaboration.
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Advanced Packaging Intern, MS - Summer 2027
Marvell
Santa Clara, CA, US
$77k–$152k
21d
Perform signal integrity (SI), power integrity (PI), and electromagnetic (EM) simulations for advanced packaging and high-speed interconnects to ensure electrical performance requirements are met.
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Staff Package Design Engineer- experienced in package development of power SiP/module
Renesas-Electronics
Zhubei, tw
22d
Design and develop package and interconnect methods for power SiP/modules, wafer level, flip-chip, and multi-chip module applications.
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Ph.D. Intern - Analog, Mixed Signal & Circuit Design
Marvell
Santa Clara, CA, US
$79k–$158k
22d
Design analog and mixed-signal circuit blocks for production-grade IP and research-stage silicon in advanced CMOS processes, supporting hyperscaler AI infrastructure.
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Principal Design Engineer
Cadence
HYDERABAD
22d
Architect, design, and deliver high-speed Analog/Mixed-Signal IPs and subsystems for next-generation connectivity and memory interfaces.
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Analog Layout Intern
Marvell
Pavia, Italy
22d
Learn IC layout development, physical verification, and design rule checks for advanced CMOS technology nodes.
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Layout Engineer (Semicon, One North)
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Persol
Singapore, S00, SG
$6k–$6k
22d
Custom Layout Engineer supporting physical implementation of Foundation IP, Analog IP, and RFIC designs across advanced semiconductor process technologies.
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Package Pathfinding Architect, MTS
Micron
MSB, Singapore
22d
Define next-generation package pathfinding and system architectures for complex memory systems, optimizing speed, bandwidth, power, capacity, and thermal/mechanical performance for datacenter to edge-AI platforms.
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Semiconductor Design Engineer
Micron
Boise, ID - Main Site
22d
Design and analyze digital and analog circuits for memory products, optimizing power delivery networks and block-level power generators.
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Senior Mask Layout Design Engineer
NVIDIA
Taiwan, Hsinchu
22d
Perform physical layout for mixed-signal functions (PLLs, high-speed I/O, ESD structures) in sub-micron CMOS technologies.
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Staff Optical Design Engineer
Lumentum
USA - CA - San Jose (Ridder)
$112k–$112k
22d
Designing high-speed optical modules and performing tolerance analysis for optical trains to support AI, cloud computing, data centers, and telecom systems.
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IC Validation Engineer Intern, MS - Summer 2027
Marvell
Santa Clara, CA, US
$69k–$137k
22d
Intern validating analog front-end designs, optoelectronic components, and board-level hardware for 800G/1.6T high-speed optical communication systems.
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Senior Staff Advance Packaging Engineer
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AMD
Bedok, S00, SG
22d
Lead end-to-end package design execution for complex heterogeneous integration products (2.5D/3D, chiplet-based) to ensure performance, cost, and schedule targets.
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Senior Staff Engineer Analog Mixed-Signal Design - Optical
Marvell
CA-ON - Ottawa
$134k–$178k
22d
Design and validation of FET and BiCMOS circuits for high-speed broadband ICs serving Data Center and Telecom markets, specifically multi-tens of GHz transimpedance amplifiers (TIAs) and optical front-end receivers.
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