Senior Optical Packaging Engineer
Core
Developing high-performance, robust fiber-to-chip packages and scalable packaging processes for optical systems integrating fibers with photonic integrated circuits.
Role type
Senior IC optical packaging engineer
Builds
Fiber-to-chip packaging prototypes and scalable assembly flows for photonic integrated circuits
Domain
Semiconductor manufacturing / Silicon photonics / Optical interconnects
Required skills
Fiber-to-chip alignment, scalable assembly process development, DFM requirements definition, experimental design and process trend analysis, manufacturing transfer and scaling, high-throughput line setup, vendor management, FA/8D failure resolution, yield and quality metrics development
Preferred skills
None stated
Technologies
Optical fibers, photonic integrated circuits (PIC), fiber attach tooling, OSAT processes, EOL vendor processes
Responsibilities
Develop optical package and fiber-to-chip alignment schemes; Develop packaging prototypes and scalable flows; Review packaging design BOMs and coordinate supply chain; Establish and update DFM requirements; Design and analyze experiments to improve performance and reliability; Work with manufacturing and vendors to scale designs; Advise on high-throughput assembly line setup; Source materials and provide feedback on evolving requirements
Seniority
Senior, hands-on IC