Advanced Packaging Design Engineering Team Lead (Hybrid)
Core
Lead complex advanced IC package design programs for high-performance Silicon ASICs, driving planning, optimization, and execution from concept through tapeout.
Role type
Senior IC advanced packaging design team lead
Builds
High-speed, robust, and scalable Silicon ASICs for global networks (TOR switches to web-scale data centers)
Domain
Semiconductor / Advanced Packaging / Networking
Required skills
High-speed package design, Signal Integrity (SI), Power Distribution Networks (PDN), EDA tools for package layout, Technical leadership, Cross-functional collaboration
Preferred skills
ASIC package design, Silicon floor planning, Testing and measurement equipment (oscilloscopes, TDR/VNA), Scripting (Python, Perl, TCL, shell)
Technologies
EDA tools, Python, Perl, TCL, Shell
Responsibilities
Lead complex package design programs from concept to tapeout; Optimize package pinouts, stack-ups, power distribution, and high-speed routing; Collaborate with silicon floor planning, SI, and PI teams; Mentor engineers and develop future package leads; Enhance package design methodologies and partner with vendors; Coordinate resources across designers, layout editors, and contractors.
Seniority
Senior, hands-on IC with team leadership
