Sr Staff Packaging Product Engineer
Core
Design, develop, and resolve issues on advanced packages for high performance power semiconductor products with high reliability, low cost, and mass production robustness.
Role type
Sr Staff IC packaging product engineer (power semiconductors)
Builds
Advanced high power discrete, multi-chip, stacked, and module packages for automotive, industrial, and IoT applications
Domain
Semiconductor manufacturing / Power electronics
Required skills
Semiconductor packaging design, Process development, Thermal-mechanical analysis, DOE design, OSAT management, Reliability testing, Project management, SPC techniques, IC packaging design rules, Material science knowledge
Preferred skills
Experience with Ag sintered die bonding, Flip chip LGA/QFN, Vacuum molding, Automotive APQP, JEDEC/IPC standards, Supply chain management
Technologies
AutoCAD, SAS, JMP, Mini Tab, Thermos-mechanical simulation software
Responsibilities
Define package design rules, process flow, and material sets; Analyze stress, thermal capability, and electrical performance; Run process DOE's to define optimum process windows; Resolve package reliability and assembly issues with OSATs; Drive reliability testing and qualification plans; Manage technical project timelines and manufacturability; Transfer NPI knowledge to sustaining teams; Collaborate on packaging roadmap aligned with product strategy
Seniority
Sr Staff, hands-on IC with leadership