CareerPlan

SOC Thermal Engineer

Austin Metro Area, United States of AmericaFull-time2026-10-29 → 2026-11-10

Core

Design and validate cooling solutions for high-performance computing systems, focusing on mobile device thermal performance and advanced IC packaging research.

Role type

Senior IC thermal engineer (mobile/SoC)

Builds

Mobile devices and high-performance computing systems

Domain

Semiconductor industry + thermal engineering

Required skills

Thermal analysis and design, Thermal modeling at silicon die and package levels, Simulation and measurement analysis, Cooling solution integration, Advanced packaging assembly knowledge, Experimental test setup design, Thermal data analysis

Preferred skills

MSEE degree, Leadership at senior engineer level, IC physical design expertise, SoC design methodologies, Low-power design techniques, Advanced packaging process knowledge, Proficiency in Ansys IcePak, Sentinel-TI, Fluent, Cadence Allegro, RedHawk

Technologies

Ansys IcePak, Sentinel-TI, Fluent, Cadence Allegro, RedHawk

Responsibilities

Design thermal solutions for chip energy efficiency and performance scaling, Provide thermal modeling for mobile devices at silicon die and semiconductor package levels, Analyze simulation and measurement results to enhance thermal management, Integrate cooling solutions into next-generation SOC architecture design

Seniority

Senior, hands-on IC