Advanced Packaging Technology & Integration Leader
Core
Lead the development of next-generation semiconductor packaging and 3D integration technologies, combining deep technical expertise with first-principles problem solving to advance AI and HPC architectures.
Role type
Senior IC advanced packaging technology leader
Builds
Next-gen semiconductor packaging solutions, 3D integration technologies, and heterogeneous integration architectures for AI/HPC and memory markets
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Hybrid bonding, Through-silicon vias (TSVs), 2.5D/3D integration, Interposers, Bridge-die technologies, Chiplet integration, Thermal management materials, Semiconductor process integration, First-principles physics reasoning, Multidisciplinary team leadership
Preferred skills
Materials science background, Thin-wafer processing, Advanced metallization, CMP and surface preparation, Mechanical stress/warpage analysis, Customer engagement with foundries/OSATs
Technologies
Cu-Cu bonding, Dielectric bonding, Silicon/alternative interposers, High-density interconnects, Backside thermal management
Responsibilities
Develop differentiated packaging technologies from first principles; Identify critical technology limitations in future AI/HPC architectures; Lead cross-functional teams spanning materials, unit-process, and integration; Establish technology roadmaps connecting device requirements to new processes; Mentor senior technical staff and influence organizations beyond direct reporting
Seniority
Senior, hands-on IC with strategic leadership
