Advanced Packaging & Heterogeneous Integration at Micron Jobs
About Micron
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. The Global Procurement (GP) team is an integral engine to Micron’s growth, delivering best‑in‑class total cost and supply chain resiliency through cutting‑edge predictive capabilities, risk analysis, and a focus on sustainability and diversity. Our business goals are directly tied to the value we
69 Open Roles
69 open roles · apply directly
- Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) · Fab 10A, Singapore
- Staff/Principal Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering · Fab 10A, Singapore
- Staff/Principal Engineer, Advanced Package Metrology-Real-Time Defect Analysis · Fab 10A, Singapore
- Staff/Principal Engineer, APTD CEM - Advanced Packaging Integration Engineering · Fab 10A, Singapore
- New College Grad - HBM SoC Design Engineer/Architect · Folsom, CA, US
- PDE API PI, Engineer · Taichung - MTB, Taiwan
- SoC Physical Design Senior Manager, HBM · Folsom, CA, US
- PDE PIE (Package Integration Engineering) Engineer · Penang, Malaysia - Grande
- Custom HBM Architecture and Design Engineer · Richardson, TX, US
- Senior Engineer - HIG HBM PSE - Design Validation · Boise, ID - Main Site
- Advanced Package Technology Development IOT MTS · Taichung - MTB, Taiwan
- Package Silicon Technology Node Development MTS · MSB, Singapore
- HBM Assembly Capacity IE Manager · Taichung - MTB, Taiwan
- Intern - HBM SoC RTL Design Engineer · Folsom, CA
- Staff Design Engineer, HBM · Richardson, TX
- PDE MRDA PROCSS ENGINEER · Taichung - MTB, Taiwan
- Sr Design Engineer, HBM · Richardson, TX
- Foundry PDK / Collateral Integration Engineer (CAD/EDA) · Richardson, TX
- Yield Enhancement (YE) Lead Engineer · Taichung - MTB, Taiwan
- Senior/Staff Equipment Development Engineer (APTD) · Singapore, Singapore
- Senior/Staff Design Verification Engineer, HBM · Richardson, Texas, United States of America
- Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering · Fab 10A, Singapore
- Advance Packaging Process Development Engineer · Taichung City, Taichung City, Taiwan
- Staff Engineer, APTD Backgrind/Edge Trim · Boise, Idaho, United States of America
- Principal/Staff Engineer Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering · Fab 10A, Singapore
- Package Health Yield (Senior/Staff/Principal) Engineer, APTD · Singapore, Singapore
- SoC Physical Verification Engineer, HBM · Folsom, CA, US
- Principal/Senior Engineer, Advanced Package Metrology-Real-Time Defect Analysis (MRDA) · Fab 10A, Singapore
- Principal/Staff/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering · Fab 10A, Singapore
- Senior Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) · Fab 10A, Singapore
- Principal DFT Engineer, HBM · Folsom, CA
- SoC Timing (Static Timing Analysis/STA) Engineer, HBM · Richardson, TX
- Design Infrastructure Engineer (Standard and Custom Cell Characterization)-HBM · Richardson, TX
- HBM 3D Power Delivery Network (PDN) Engineer · Richardson, Texas, United States of America
- Senior RDA Engineer, APTD · Boise, ID - Main Site
- Sr RDA Engineer, Advanced Packaging · Boise, ID - Main Site
- SR ENGINEER, APTD PHOTO Process · Taichung City, Taichung City, Taiwan
- Package Silicon Technology Node Development Director/DMTS · Singapore, Singapore
- Package Device Product Engineer (PDPE) Engineer · Sanand - 303A - AT/SSD/MOD, India
- HBM SIPI, Staff Engineer · Richardson, TX, US
- ENGINEER, PACKAGE DEVELOPMENT ENGINEERING, PACKAGE SILICON INTEGRATION · MSB, Singapore
- Staff Design Verification Engineer, HBM Architecture · Richardson, TX
- Staff Engineer, APTD Dry Etch · Boise, Idaho, United States of America
- Staff Engineer, APTD Photolithography · Boise, ID - Main Site
- Director, PDE Advance Packaging · Fab 10A, Singapore
- Principal Design Engineer, HBM · Richardson, TX
- Senior Package Design Engineer · Boise, ID - Main Site
- SoC Architecture and Design Engineer, Senior Member of Technical Staff (SMTS) · Richardson, TX, US
- HBM Sr RTL Engineer · Richardson, TX
- Staff Process Engineer, APTD Bonding · Boise, ID - Main Site
- Equipment Technician, Advanced Packaging · Boise, Idaho, United States of America
- Process Technician, Advanced Packaging · Boise, ID - Main Site
- Senior Business Analyst - APTD · Fab 10A, Singapore
- Package Characterization Lab Manager, APTD · Fab 10A, Singapore
- HBM SoC RTL Design Engineer · Folsom, CA
- Staff Design Verification Engineer, HBM · Richardson, TX
- HBM SoC Physical Design Engineer · Richardson, Texas, United States of America
- Principal Process Engineer, Die Bonding · Boise, Idaho, United States of America
- Process Integration Engineer | APTD · Boise, ID - Main Site
- SMTS Process Engineer RDA /Metrology · Boise, ID - Main Site
- Sr/Staff Design Verification Engineer, HBM Verification Architecture · Richardson, TX
- Sr Manager Design Development Technical Leadership, HBM · Richardson, TX
- Sr Engineer, Advanced Packaging Design Enablement Engineering (APDEE) · Hyderabad - Phoenix Aquila, India
- Principal Engineer Advanced Package Technology Development · Fab 10N/X, Singapore
- Staff Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) Product Engineering · Fab 10A, Singapore
- Staff Engineer, Package Development & Engineering · MSB, Singapore
- Snr/Product Engineer (Advance Data Analytics), Heterogeneous Integration Group (HIG), High Bandwidth Memory (HBM) Product Engineering · Singapore, Singapore
- Principal / Senior/ Engineer, Package Characterization - APTD · Fab 10A, Singapore
- HIG HBM PE Principal Component Validation Engineer · Fab 10A, Singapore
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