Senior/Staff Equipment Development Engineer (APTD)
Core
Develop and optimize next-generation wafer and die equipment (post-probe) for advanced packaging, driving technology roadmaps and enabling manufacturing capability.
Role type
Senior/Staff Equipment Development Engineer (Advanced Packaging)
Builds
First-of-a-kind (FAOK) wafer and die processing equipment for semiconductor manufacturing
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | infrastructure
Required skills
Equipment development, failure analysis, FMEA, 8D, data science methodology, hardware roadmap planning, process integration, root cause analysis, statistical process control (SPC), design of experiments (DOE)
Preferred skills
Python, R, SQL, Visual Basic, E3, FDC, RMS, MES, AI tool integration
Technologies
Python, R, SQL, Visual Basic, E3, FDC, RMS, MES, Autoshell
Responsibilities
Develop and optimize advanced packaging equipment for wafer-level packaging and stacking; Establish and improve equipment management projects to deliver tech node requirements; Evaluate and promote new equipment and materials to enhance process capabilities; Establish hardware strategic roadmaps for 5+ years in post-probe wafer and die processing; Lead the transition from new product development to high volume production; Collaborate with process development teams to develop innovative new solutions; Conduct continuous data analysis to establish advanced controls; Perform fundamental research to drive innovative solutions for next-generation equipment products.
Seniority
Senior/Staff, hands-on IC with strategic roadmap ownership
