Principal Engineer Advanced Package Technology Development
Core
Lead the development of advanced semiconductor packaging technologies, including 2.5D and 3D integration strategies, to drive innovation and strategic goals for memory solutions.
Role type
Principal Engineer, Advanced Package Technology Development
Builds
High-performance memory and storage technologies (DRAM, NAND, NOR, 3D XPoint)
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | infrastructure
Required skills
Advanced packaging engineering, High Bandwidth Memory expertise, 2.5D integration, 3D integration, Hybrid bonding, Wafer Level Packaging, 3D stacking process, DRAM manufacturing, OSAT operations
Preferred skills
DRAM wafer structure knowledge, East Asian languages, patent inventions, published literature
Technologies
Hybrid bonding, 2.5D integration, 3D integration, Wafer Level Packaging, 3D stacking
Responsibilities
Guide packaging technology roadmaps, assess competitive metrics, define technical requirements, troubleshoot advanced issues, mentor teams, drive cost reduction and quality improvement
Seniority
Principal, strategy & mentorship