Principal Engineer Advanced Package Technology Development
Core
Lead the development of advanced semiconductor packaging technologies, including 2.5D/3D integration and hybrid bonding, to drive innovation and strategic goals for Micron's memory solutions.
Role type
Principal Engineer, Advanced Package Technology Development
Builds
High-bandwidth memory (HBM) and advanced packaging solutions for data centers and AI applications
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Advanced packaging engineering, 2.5D/3D integration, hybrid bonding, DRAM manufacturing, OSAT operations, process module engineering, Wafer Level Packaging, 3D stacking, competitive analysis, technical roadmap planning, patent development
Preferred skills
DRAM wafer structure knowledge, East Asian languages, innovation via patents/publications
Technologies
HBM, 2.5D, 3D stacking, Hybrid bonding, Wafer Level Packaging, OSAT processes
Responsibilities
Define requirements with proven technical data, guide development of packaging technology roadmaps, assess competitive metrics through data intelligence, troubleshoot advanced issues, mentor teams, collaborate with internal/external partners, influence senior management decisions, drive cost reduction and quality improvement initiatives
Seniority
Principal, strategic leadership & hands-on technical expertise