ENGINEER, PACKAGE DEVELOPMENT ENGINEERING, PACKAGE SILICON INTEGRATION
Core
Early-career engineer supporting NAND package and silicon integration for next-generation memory products.
Role type
Junior IC package development engineer
Builds
High-volume manufacturing memory products (NAND)
Domain
Semiconductor manufacturing / Memory storage
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor manufacturing concepts, Packaging concepts, FMEA, DOE, Data analysis, Technical documentation, Microsoft Excel, Problem-solving
Preferred skills
None stated
Technologies
None stated
Responsibilities
Support chip-package interaction (CPI) assessments by collecting data and performing basic analysis, Assist package design and assembly engineers in investigating wafer dicing and singulation topics, Participate in DFMEA/PFMEA activities by preparing inputs and tracking action items, Work with wafer fab and manufacturing teams to support yield and quality investigations, Support execution of test vehicles and DOEs including data collection and report preparation, Prepare technical documentation and presentation materials for design reviews
Seniority
Junior, early-career IC
