Staff Engineer, APTD Dry Etch
Core
Develop and optimize dry etch process modules for advanced packaging products (HBM) to meet performance, yield, and reliability requirements.
Role type
Staff Engineer, Semiconductor Process R&D (Dry Etch)
Builds
Production-ready plasma-based etch processes for next-generation packaging technologies
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Dry etch process development, DOE (Design of Experiments), data analysis, first-principles reasoning, root-cause analysis, equipment innovation, process integration, statistical process control
Preferred skills
Plasma-material interactions, advanced packaging technologies (TSV, RDL, hybrid bonding, 2.5D/3D integration), Python, data automation, GenAI-enabled analysis
Technologies
Plasma etch equipment, Python, GenAI tools
Responsibilities
Develop and optimize dry etch process modules; Drive process capability, cost, and variability improvements; Collaborate with process integration and adjacent teams; Perform root-cause and failure-mode analysis; Support global process transfer and readiness for high-volume manufacturing
Seniority
Staff, hands-on IC with strategic influence