PDE API PI, Engineer
Core
Drive process integration excellence for Advanced Packaging products, specifically High Bandwidth Memory (HBM), ensuring robust process readiness and yield ramp from New Product Introduction (NPI) through sustained High Volume Manufacturing (HVM).
Role type
Senior Process Integration (PI) Engineer
Builds
HBM technology roadmaps and cross-module integration across Front-end, Assembly, and Test
Domain
Semiconductor manufacturing / Advanced Packaging / Memory and Storage
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Process integration expertise, yield improvement strategy, cross-site integration management, technical analysis, risk mitigation, program leadership
Preferred skills
AI tool integration, digital fluency, stakeholder influence
Technologies
AI-assisted tools, process characterization frameworks
Responsibilities
Define PI technical direction and integration frameworks for HBM programs, lead process characterization and systemic yield improvement, resolve complex yield and reliability issues, anticipate and mitigate cross-site integration risks, represent PI in program forums with data-driven recommendations
Seniority
Senior, hands-on IC
