Staff/Principal Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering
Core
Develop and optimize assembly processes for advanced packaging technologies (wafer-level packaging, die stacking) to enable high-performance memory products for AI and data center applications.
Role type
Staff/Principal Engineer, Advanced Packaging Process Development
Builds
High-bandwidth memory (HBM) packages and advanced packaging solutions for next-gen compute
Domain
Semiconductor manufacturing / Advanced Packaging / Memory Technology
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor process development, wafer bonding, die stacking, Python, R, SQL, statistical analysis, process modeling, data analytics, SPC, DOE, defect analysis, equipment evaluation, Visual Basic automation, E3, FDC, RMS
Preferred skills
Experience with high-volume manufacturing transfer, cross-functional collaboration, AI tool integration
Technologies
Python, R, SQL, Visual Basic, E3, FDC, RMS
Responsibilities
Develop and optimize assembly processes for advanced packaging technologies; Evaluate and promote new equipment and materials to enhance process capabilities; Ensure defense coverage through process, measurement, inspection, and testing; Collaborate with internal and external stakeholders to integrate manufacturing processes; Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer
Seniority
Staff/Principal, hands-on IC with strategic coordination
