Principal/Senior Engineer, Advanced Package Metrology-Real-Time Defect Analysis (MRDA)
Core
Developing and enabling innovative inspection and metrology techniques for advanced packaging technologies, specifically focusing on real-time defect analysis (RDA) and yield improvement.
Role type
Principal/Senior Engineer, Advanced Package Metrology-Real-Time Defect Analysis (MRDA)
Builds
High performance memory products (HBM) and advanced packaging solutions for AI, VR, and supercomputing.
Domain
Semiconductor manufacturing, Advanced Packaging, Metrology
Deliverable
production ML models | product features | dashboards & analysis | infrastructure
Required skills
Semiconductor process/equipment engineering, Python, R, SQL, Visual Basic, E3, FDC, RMS, SPC, DOE, root cause analysis, wafer/assembly tools operation
Preferred skills
Wafer bonding, plating, warpage control, packaging field experience
Technologies
Power BI, E3, FDC, RMS, Visual Basic
Responsibilities
Develop and optimize metrology recipes for semiconductor processes; Establish inspection methodologies and best-known methods (BKM); Perform in-line characterization and validation of metrology recipes; Utilize data analysis tools to summarize and report on metrology recipe status; Own and manage metrology tools to meet performance indicators; Engage with cross-functional teams to integrate new technologies into manufacturing processes
Seniority
Senior, hands-on IC
