Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering
Core
Developing and enabling deployment of advanced packaging technologies for high-performance memory products (HBM) to meet performance, cost, and reliability requirements.
Role type
Principal/Senior Semiconductor Process Integration Engineer
Builds
Advanced packaging solutions for high-bandwidth memory (HBM) and compute technologies
Domain
Semiconductor manufacturing / Advanced Packaging / Memory Technology
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor process integration, Python, R, SQL, Statistical analysis, Process modeling, Data analytics, Root-cause analysis, SPC, DOE, Defect analysis, Visual Basic, E3, FDC, RMS
Preferred skills
Advanced package technology know-how, Post-fab wafer finish and assembly processes, AI tool integration
Technologies
Python, R, SQL, Visual Basic, E3, FDC, RMS
Responsibilities
Develop advanced package technology for post-fab wafer finish and assembly processes; Improve product quality, yield, and productivity; Integrate semiconductors with process and product engineering teams; Analyze data to drive layout, design, or integration flow changes; Ensure defense coverage through process, measurement, and testing; Coordinate technology development strategies with internal and external stakeholders.
Seniority
Senior, hands-on IC
