Staff Process Engineer, APTD Bonding
Core
Develop, optimize, and validate advanced packaging bonding processes for next-generation memory and storage products to ensure yield, reliability, and cost efficiency.
Role type
Staff Process Engineer (Semiconductor Packaging)
Builds
Next-generation semiconductor memory and storage products (DRAM, NAND)
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
DOE, Statistical Process Control (SPC), defect analysis, root-cause problem solving, failure analysis, FMEA, 8D methodology, process formulation, equipment specification, supplier audit
Preferred skills
Project team leadership, advanced degree in relevant engineering field
Technologies
SPC, FDC, RMS, APC, DOE tools
Responsibilities
Develop new or modified process formulations and define equipment requirements; Identify, diagnose, and resolve assembly process-related problems; Coordinate and complete process, equipment, and material evaluation initiatives; Validate and fan out new process baselines for new product introduction; Support SPC/FDC/RMS/APC and site-to-site portability; Audit material suppliers for quality, cost, and risk management objectives
Seniority
Staff, hands-on IC with strategic oversight
