Sr RDA Engineer, Advanced Packaging
Core
Analyze experimental process flows and defect anomalies using inline process signals to drive continuous improvement in semiconductor packaging.
Role type
Sr IC Realtime Defect Analysis (RDA) Engineer
Builds
Next-generation memory and storage interconnects and packaging solutions
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
root-cause analysis, data manipulation, correlation analysis, process integration knowledge, equipment concepts, scripting/coding
Preferred skills
metrology tool operation, technical writing, research experience
Technologies
SEM, X-ray, Laser, Optical Systems
Responsibilities
Review and analyze experimental process flows for defect anomalies; Work with new inspection tools to drive earlier detection of problems; Identify and raise awareness of process anomalies; Build and improve techniques to identify relevant process issues; Participate in technical meetings to synthesize novel approaches; Collaborate globally to develop best-known methods
Seniority
Senior, hands-on IC