Staff Engineer, APTD Photolithography
Core
Developing and optimizing photolithography processes for advanced packaging applications, including thick and ultra-thick photoresist patterning, to impact product quality, yield, and reliability.
Role type
Process Engineer (Advanced Packaging Photolithography)
Builds
Next-generation memory and packaging technologies for the AI era
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
photolithography fundamentals, resist processing, alignment, overlay, CD control, DOE, SPC, data-driven analysis, failure analysis, FMEA, statistical methods
Preferred skills
advanced packaging or backend semiconductor technologies, lithography tools and track systems, lithography-related metrology, high-aspect-ratio or large topography features, wafer thinning, plasma dicing, bonding, packaging-specific patterning
Technologies
lithography tools, track systems, metrology equipment
Responsibilities
Develop and optimize photolithography processes; Drive yield improvement, defect reduction, cost optimization, and risk management; Identify, diagnose, and resolve lithography-related process issues; Lead process, equipment, and material evaluations; Collaborate with cross-functional teams and suppliers for technology transfer
Seniority
Mid-level, hands-on IC
