Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM)
Core
Drive package and HBM product engineering activities to improve assembly yield, reduce defects, and optimize manufacturing processes for next-generation High Bandwidth Memory products.
Role type
Senior IC Product Engineer (Heterogeneous Integration & Advanced Packaging)
Builds
Next-generation HBM products for data centers, AI, and high-performance computing
Domain
Semiconductor manufacturing, Advanced Packaging, Heterogeneous Integration
Deliverable
production ML models | product features
Required skills
Root cause analysis (EFA/PFA), Semiconductor packaging engineering, Yield improvement strategies, Statistical data analysis, Test flow management, Circuit analysis, Project management
Preferred skills
Advanced packaging experience, AI/ML model deployment, Process conversion expertise
Technologies
EFA, PFA, Statistical analysis tools, Scripting languages
Responsibilities
Improve assembly yield and DPM by optimizing manufacturing flows; Enhance HBM Cube yield through test optimization and coverage expansion; Lead cross-functional initiatives to drive cumulative yield and quality improvements; Debug and resolve qualification and RMA packaging issues using failure analysis; Establish robust process conversion business processes to facilitate yield and performance gains; Collaborate with Fab, Design, and System teams for holistic product development; Deploy and validate AI/ML models to enhance Quality, Cost, Cycle Time, and Scale KPIs.
Seniority
Senior, hands-on IC
