Principal / Senior/ Engineer, Package Characterization - APTD
Core
Advanced Packaging Characterization Engineer providing package development characterization and failure analysis support for development test vehicles, qualifications, customer returns, and new product introductions.
Role type
Senior IC failure analysis engineer (advanced packaging)
Builds
Advanced packaging technology development solutions for memory and storage products
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Failure analysis methodologies, SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X-ray, CSAM, Ion Milling, delayering, decapsulation, electrical verification, de-processing techniques
Preferred skills
TMO training and FA certification, industry expert engagement, technical mentorship
Technologies
SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X-ray, CSAM, Ion Milling
Responsibilities
Conduct electrical characterization and de-processing of failures, analyze backend test flows and qualification methodologies, document failure analysis techniques for internal groups, maintain FA lab equipment and compliance with safety/ISO standards, coordinate with Process Integration and Product Engineering groups
Seniority
Senior, hands-on IC
