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Custom HBM Architecture and Design Engineer

Richardson, TX, US💼 Full-time💰 $165,000–$165,000🗓 2026-09-03 → 2026-09-26

Core

Architect, design, and implement RTL for next-generation HBM SoC logic die, focusing on memory sub-systems, IP integration, and system-level optimization for AI/ML workloads.

Role type

Senior IC Custom HBM Architecture and Design Engineer

Builds

High-performance HBM SoC logic die and memory sub-systems

Domain

Semiconductor / High-performance Memory / AI/ML Hardware

Deliverable

production ML models | product features

Required skills

SystemVerilog/Verilog, SoC integration methodologies, RTL-to-GDS flow, EDA tools (Cadence/Synopsys/Siemens), Python/TCL/Perl scripting

Preferred skills

HBM/DRAM memory-centric SoC design, high-speed interfaces and clocking strategies, DFT concepts (scan/MBIST), hardware emulation platforms

Technologies

SystemVerilog, Verilog, Cadence, Synopsys, Siemens, Python, TCL, Perl, Palladium, Veloce, Zebu

Responsibilities

Analyze hardware/software interaction to identify AI/ML workload bottlenecks; Architect and design memory sub-systems including IP selection and power/performance/area optimization; Integrate internal and third-party IP (controllers, NOC, RAS, PHY-adjacent logic); Translate architectural specifications into high-quality RTL implementations; Participate in SoC-level integration (clocking, reset, power intent); Assist with pre/post-silicon validation and root-cause analysis; Collaborate with Product Engineering, Test, and Manufacturing teams

Seniority

Senior, hands-on IC

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