Staff Engineer, Package Development & Engineering
Core
Providing technical leadership and strategic oversight for advanced packaging initiatives to drive technology enablement, yield acceleration, and integration of next-generation packaging solutions.
Role type
Staff Engineer, Program Management & Technical Strategy
Builds
Advanced packaging technologies (hybrid bonding, CoWoS, chiplet integration) for semiconductor manufacturing
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Advanced packaging flows (hybrid bonding, CoWoS, chiplet integration), Cross-functional program leadership, Technical roadmap definition, CapEx/OpEx planning, Governance framework establishment, KPI definition for yield and maturity, Technical review and validation, Mentorship
Preferred skills
Micron PDE/CPI/NPI frameworks, Simulation modeling, Yield enhancement, Defectivity analysis
Technologies
CoWoS, Hybrid bonding, Chiplet integration, BOP design systems
Responsibilities
Own full lifecycle of PDE technology pillars including roadmap definition and execution, Define technical objectives and resource allocation for pillar initiatives, Lead cross-functional engineering teams across TD, HVM, CPI, DRAM, and NPI, Develop and enforce standardized methodologies for technical program management, Drive CapEx/OpEx planning and integration of BOP design systems, Align pillar objectives with mission to embed analytics and simulation into workflows, Define and monitor KPIs for technology maturity and yield performance, Conduct technical reviews to validate outcomes and capture lessons learned, Mentor engineers and promote best practices for technical program management
Seniority
Staff, hands-on IC with strategic oversight