Package Characterization Lab Manager, APTD
Core
Lead a high-performing team of shift engineers and technicians delivering package characterization and failure analysis (FA) support for leading-edge technology development in advanced packaging.
Role type
Senior IC lab manager (semiconductor failure analysis)
Builds
Package characterization and failure analysis capabilities for advanced packaging technologies
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor package characterization, Failure analysis methodologies, Lab operations management, Equipment calibration and maintenance, Vendor management, Team leadership and mentoring, Budget planning, Cross-functional collaboration
Preferred skills
Master's or PhD in Materials Science, Physics, Chemistry, or related field
Technologies
SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X-ray, CSAM, ion milling, delayering, decapsulation
Responsibilities
Lead lab operations to meet key performance metrics, cycle-time and safety standards; Plan and optimize FA lab equipment, space, and budget; Coordinate equipment calibration, repairs, and spare parts procurement; Evaluate and introduce new FA tool models and capabilities; Lead EHS, quality, TS, ISO14001, OHSAS, and customer audits; Provide technical mentorship and drive continuous improvement of package characterization methodologies; Collaborate cross-site to benchmark and standardize best-known methods; Build and sustain a robust training and development program for lab engineers and technicians; Define, track, and review performance metrics to identify gaps and drive accountability.
Seniority
Senior, hands-on IC with people management
