PDE MRDA PROCSS ENGINEER
Core
Engineer in Package Development & Engineering (MRDA) responsible for process, equipment, and materials definition, development, and optimization to ensure advance packaging success.
Role type
Senior IC process engineer (packaging)
Builds
Memory and storage solutions (DRAM, NAND, NOR)
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features
Required skills
Process flow analysis, defect anomaly identification, real-time data analysis, image classification model management, AI tool integration, yield improvement strategies, experimental design, supplier collaboration, global process alignment
Preferred skills
Technical paper writing, KPI system maintenance, AI-powered operational efficiency optimization
Technologies
AI tools, image classification models, inline process signals, SWR analysis tools
Responsibilities
Design and analyze SWRs to implement process changes for yield improvements; Identify and advocate for key conversions to improve yields; Develop reports tracking defect performance metrics; Reduce scrap and mitigate excursions through process characterization; Collaborate with suppliers to improve inline detection; Partner with production to implement corrective actions for excursions; Leverage AI tools to enhance operational efficiency and problem-solving.
Seniority
Senior, hands-on IC
