Staff/Principal Engineer, APTD CEM - Advanced Packaging Integration Engineering
Core
Develop and enable advanced packaging technologies for high-performance memory products (HBM), focusing on post-fab wafer finish and assembly processes to drive yield, quality, and cost improvements.
Role type
Staff/Principal Semiconductor Process Integration Engineer
Builds
Advanced packaging solutions for high-bandwidth memory (HBM) and next-gen compute technologies
Domain
Semiconductor manufacturing / Advanced Packaging / Memory Technology
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor process integration, Python, R, SQL, statistical analysis, process modeling, data analytics, SPC, DOE, defect analysis, Visual Basic automation, E3, FDC, RMS
Preferred skills
PhD in Electrical/Materials/Chemical Engineering/Physics, experience with post-fab wafer finish and assembly, AI tool integration
Technologies
Python, R, SQL, Visual Basic, E3, FDC, RMS
Responsibilities
Develop advanced package technology for post-fab processes; diagnose and propose yield breakthroughs; integrate semiconductors with process/product teams; analyze data for layout/design flow changes; ensure defense coverage via process/measurement/testing; coordinate technology launch and production transfer; apply AI tools for efficiency and problem-solving
Seniority
Staff/Principal, hands-on IC with strategic coordination
