Staff/Principal Engineer, Advanced Package Metrology-Real-Time Defect Analysis
Core
Develop and optimize metrology recipes, establish inspection methodologies, and analyze data to drive yield breakthroughs in advanced semiconductor packaging.
Role type
Staff/Principal Engineer, Advanced Package Metrology-Real-Time Defect Analysis
Builds
High bandwidth memory (HBM) and advanced packaging solutions for AI and compute technologies
Domain
Semiconductor manufacturing / Advanced Packaging / Metrology
Deliverable
production ML models | product features | dashboards & analysis | infrastructure
Required skills
Python, R, SQL, Visual Basic, E3, FDC, RMS, SPC, DOE, defect analysis, wafer/assembly tool operation, process flow modeling
Preferred skills
AI tool integration, statistical analysis, cross-functional collaboration
Technologies
Power BI, E3, FDC, RMS, Visual Basic
Responsibilities
Develop and optimize metrology recipes for semiconductor processes; Establish inspection methodologies and best-known methods (BKM); Utilize data analysis tools to summarize recipe status and report project progress; Manage metrology tools to meet performance indicators and quality standards; Integrate AI-assisted tools to improve efficiency and quality
Seniority
Staff/Principal, hands-on IC with strategic coordination
