Staff Engineer, APTD Backgrind/Edge Trim
Core
Develop and optimize wafer edge trim, backgrind, and thinning processes for advanced memory products, conducting root-cause analysis and early-stage pathfinding for ultra-thin wafer processing.
Role type
Staff Engineer, mechanical wafer processing R&D
Builds
Production-ready mechanical wafer processing modules for next-generation advanced packaging
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Wafer edge trim, backgrind, and thinning process expertise, Experimental design (DOE), Data analysis, Root-cause analysis, Physics-based problem solving, Project management
Preferred skills
Statistical process control (SPC), Python scripting, Advanced packaging technologies (wafer-level, bonding/de-bonding, 2.5D/3D integration)
Technologies
MS Office, Data visualization tools
Responsibilities
Develop and optimize wafer edge trim, backgrind, and thinning processes to meet mechanical, electrical, and reliability requirements; Improve process capability, yield, cost efficiency, and wafer integrity through data-driven optimization; Conduct root-cause and failure-mode analyses to understand wafer damage mechanisms; Perform fundamental research and early-stage pathfinding to enable ultra-thin wafer processing; Support process transfer and ramp to production at manufacturing sites
Seniority
Staff, hands-on IC with strategic ownership
