Staff Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) Product Engineering
Core
Lead a high-performing team to drive Package and HBM Product engineering activities, focusing on yield, quality, cost, cycle time, and scale for next-generation Heterogeneous Memory Cube products.
Role type
Staff Engineer, Product Engineering (Heterogeneous Integration)
Builds
High Bandwidth Memory (HBM) systems and products
Domain
Semiconductor manufacturing, Advanced Packaging, Memory Storage
Deliverable
production ML models | product features
Required skills
Root cause analysis (EFA/PFA), Circuit analysis, Statistics and data analysis, Process conversion management, Team leadership, Cross-functional collaboration, Project management, Technical decision making, AI/ML model deployment
Preferred skills
None explicitly stated
Technologies
Electric Failure Analysis (EFA), Physical Failure Analysis (PFA), AI/ML models
Responsibilities
Improve assembly yield and DPM, Optimize HBM Cube yield through test coverage, Lead cumulative yield improvement initiatives, Debug and resolve packaging failures, Establish process conversion business processes, Mentor and develop team members, Collaborate with Fab/Design/Quality teams, Promote innovation for competitive advantage, Manage project execution and prioritization
Seniority
Staff, hands-on IC with team leadership