Yield Enhancement (YE) Lead Engineer
Core
Lead a team of Yield Enhancement Engineers to ensure predictable yield ramps, fast learning closure, and robust manufacturing readiness for High Bandwidth Memory (HBM) New Product Introduction (NPI).
Role type
Senior IC Yield Enhancement Lead Engineer (HBM NPI).
Builds
HBM NPI builds across PWF, Assembly, and Test.
Domain
Semiconductor manufacturing / Advanced Packaging / HBM.
Deliverable
production ML models | product features | dashboards & analysis | client delivery | infrastructure | physical/clinical work
Required skills
Yield analysis, SPC, excursion management, NPI ramp support, team leadership, root cause analysis, stakeholder management, defect breakdown, PFA submission, yield dashboard maintenance, cross-functional collaboration, AI tool integration.
Preferred skills
People management or senior technical leadership experience, advanced packaging/HBM/3D-stacked technology support, yield stabilization during aggressive ramps, data analytics, yield dashboards, automation initiatives.
Technologies
Auto-diagnostics, SPC charts, FDC charts, YLR dashboard.
Responsibilities
Build and lead a high-performing YE team; Account for HBM NPI builds through defect breakdown and PFA submission; Analyze and report on yield deviation issues; Provide leadership oversight for major yield excursions; Act as the primary YE interface to PI, MRDA, and Process Engineering; Integrate AI-assisted tools into daily work.
Seniority
Senior, hands-on IC with people leadership.
