Advance Packaging Process Development Engineer
Core
Develop, configure, and optimize package assembly processes (front end, bonding, back end) for memory product ramp-up, including side-by-side certification with manufacturing teams.
Role type
Junior IC process development engineer (semiconductor packaging)
Builds
Memory products (DRAM, NAND, NOR) and innovative package technologies
Domain
Semiconductor manufacturing / Memory and storage
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor manufacturing process knowledge, hands-on packaging process experience, data interpretation, analytical problem-solving, cross-functional collaboration
Preferred skills
High Bandwidth Memory (HBM) integration, TCB (Thermal Compression Bonding), CMP (Chemical Mechanical Polish), Ball Mount, Photo, PVD, CVD, wafer level molding, Flip Chip, Underfill, Hybrid bond, Glass carrier bond/de-bond
Technologies
TCB, CMP, Ball Mount, Photo, PVD, CVD, wafer level molding, Flip Chip, Underfill, Hybrid bond, Glass carrier
Responsibilities
Develop and optimize package assembly processes, assess processes by taking measurements and interpreting data, run, test, and upgrade systems and processes, approve material and equipment changes in the CCB
Seniority
Junior, entry-level (0-2 years experience)
