PDE PIE (Package Integration Engineering) Engineer
Core
Lead New Product Introduction (NPI) activities as a Product Owner to drive semiconductor package development from startup through volume production and end-of-life.
Role type
Senior IC Product Owner (Package Integration Engineering)
Builds
New memory and storage packages (DRAM, NAND, NOR) for data center, AI, 5G, and mobile applications
Domain
Semiconductor manufacturing / Memory and storage solutions
Deliverable
production ML models | product features | dashboards & analysis | client delivery | infrastructure | physical/clinical work
Required skills
NPI process management, semiconductor package structure knowledge, package reliability concepts, statistical analysis, JMP proficiency, data-driven decision making, cross-functional collaboration
Preferred skills
AI-assisted tool usage (e.g., Copilot for root cause screening, DOE design, automated reporting), component test knowledge, module manufacturing process knowledge
Technologies
JMP, NPI Phase Gate Review tools, AI productivity tools
Responsibilities
Lead NPI activities and manage Product Owner responsibilities; Drive NPI process through Phase Gate Reviews; Coordinate new product startup and achieve first pass qualification; Monitor product yield trends, QDR, and reliability; Own the entire Product Life Cycle from NPI to EOL; Collaborate with process/equipment/development owners to develop new technology capabilities; Act as point of contact for TPM on product matters
Seniority
Senior, hands-on IC
