Principal Process Engineer, Die Bonding
Core
Develop, optimize, and validate die bonding processes to improve product quality, reliability, yield, and cost in semiconductor advanced packaging.
Role type
Principal Process Engineer (Die Bonding)
Builds
Next-generation memory and storage semiconductor products
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor process engineering, Die stacking processes, Design of Experiments (DOE), Failure analysis, FMEA, 8D, SPC/FDC methodology, Data analysis, Project management
Preferred skills
Fusion Bonding, Hybrid Bonding, Direct Bonding, MEMS, Imager, Memory, Heterogeneous Integration, Vendor/Equipment supplier experience
Technologies
SPC, FDC, RMS, APC
Responsibilities
Develop and optimize die bonding process technologies; Execute process, equipment, and material evaluation initiatives; Lead continuous yield improvement and cost reduction activities; Validate new process baselines for product introduction; Manage material supplier relationships for quality and risk; Support SPC/FDC/RMS/APC and site portability; Support internal and external audits
Seniority
Principal, hands-on IC with strategic oversight
