Director, PDE Advance Packaging
Core
Lead New Product Introduction (NPI) execution and strategic direction for advanced semiconductor packaging technologies, ensuring on-time qualification and transition to High Volume Manufacturing.
Role type
Director, Advanced Packaging NPI
Builds
Advanced packaging solutions (e.g., HBM, 3D stacking) for memory and storage products
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
NPI execution, process engineering, people leadership, cross-functional collaboration, root cause analysis, data analysis, yield management, regulatory compliance
Preferred skills
Advanced packaging technologies (HBM, 3D stacking), global team management, executive presentation
Technologies
JMP, Python, SPC charts, FMEA, MRDA, ADC, POS, VMP, DMP
Responsibilities
Set strategic direction for NPI teams, own accountability for NPI execution plans and milestones, lead cross-functional reviews and Phase Gate meetings, oversee execution of NPI lots and yield ramp activities, drive continuous improvement programs for yield and scrap reduction, manage team performance and talent development
Seniority
Director, strategic & operational leadership