Senior Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM)
Core
Drive package and HBM product engineering activities to improve assembly yield, reduce defects, and optimize manufacturing processes for next-generation High Bandwidth Memory products.
Role type
Senior Product Engineer (Heterogeneous Integration)
Builds
Next-generation HBM products for data centers and AI applications
Domain
Semiconductor manufacturing / Advanced Packaging / High Bandwidth Memory
Deliverable
production ML models | product features
Required skills
Root cause analysis, circuit analysis, statistics, data analysis, scripting, test flow management, assembly process knowledge, advanced packaging knowledge, project management, technical decision making
Preferred skills
AI/ML model development, AI agent usage, leadership
Technologies
Electric Failure Analysis (EFA), Physical Failure Analysis (PFA)
Responsibilities
Improve assembly yield and defect density (DPM), optimize HBM cube yield through test coverage, lead cumulative yield improvement initiatives, debug and resolve packaging failures, establish process conversion business processes, collaborate with cross-functional teams, promote innovation in manufacturing, manage project execution and prioritization
Seniority
Senior, hands-on IC
