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Hardware & Physical Engineering
› ASIC Physical Design
ASIC Physical Design
1,643 open positions
Timing Design Engineer
Apple
Beaverton, United States of America
8mo
Ensuring timing sign-off and developing STA flows for SoC design across synthesis to sign-off.
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Sr Principal ASIC / RTL Design Engineer
ON Semiconductor
Bangalore, Karnataka, India
8mo
Senior Principal Digital Design Engineer developing power management products (DC-DC PMIC, controllers, SiC drivers) for consumer, industrial, and automotive applications.
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CPU Power Engineer
Apple
Santa Clara, United States of America
8mo
Develop micro-architecture and circuit innovations to reduce CPU power, modeling and measuring power efficiency across pre- and post-silicon stages for millions of customers.
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SoC Physical Design Engineer (M, F, D)
Apple
Munich, Germany
8mo
Own block-level physical design implementation from netlist to GDS delivery for complex SoCs using new process technology.
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Principal ASIC Design Engineer
ON Semiconductor
Bangalore, Karnataka, India
8mo
Lead the micro-architecture, implementation, and verification of a digital sub-system within the Treo platform, a high-performance analog and mixed-signal solution for automotive, medical, industrial, and AI data center markets.
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SoC Physical Design Engineer, PnR
Apple
Austin, United States of America
8mo
Lead physical design implementation for high-performance, low-power SoCs from RTL to GDS, optimizing timing, area, and power.
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GPU Power Efficiency Engineer
Apple
Austin, United States of America
8mo
Design and manufacture next-generation, high-performance, power-efficient processor and system-on-chip (SoC) for Apple devices, specifically focusing on GPU efficiency.
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ASIC Design Engineer – Fabric/Interconnect
Apple
Santa Clara, United States of America
8mo
Design and integration of coherent and non-coherent interconnect fabrics (NoC, crossbars) and memory hierarchies into SoC subsystems.
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Senior Physical Design Engineer - Signoff Methodology
Cisco
Armenia
8mo
Develop and refine backend methodologies and flows from RTL to GDS, focusing on signoff disciplines for high-quality VLSI designs.
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Digital Design Engineer (New Grad)
Monolithicpower
Taipei - Taiwan
8mo
Design, development, and verification of digital and mixed-signal integrated circuits (ICs) for power management and portable/non-portable markets.
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Datacenter GPU Power Architect
NVIDIA
US, CA, Santa Clara
$116k–$116k
8mo
Develop state-of-the-art GPUs and power estimation models to deliver exceptional performance-per-watt solutions for AI, HPC, Automotive, GeForce, and Mobile products.
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Graphics (GPU) Architectural Modeling Engineer
Apple
Orlando, United States of America
8mo
Design and manufacture next-generation, high-performance, power-efficient processor and system-on-chip (SoC) for Apple devices, focusing on pre-silicon functional and performance modeling of low power GPUs.
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Graphics (GPU) Architectural Modeling Engineer
Apple
Santa Clara, United States of America
8mo
Design and manufacture next-generation, high-performance, power-efficient processor and system-on-chip (SoC) for Apple devices, focusing on pre-silicon functional and performance modeling of low power GPUs.
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Senior VLSI CAD and AI Automation Engineer
NVIDIA
Israel, Yokneam
8mo
Developing and integrating advanced CAD solutions and automation flows using AI and machine learning for VLSI design, verification, and implementation.
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Senior Digital Design Engineer
MediaTek
Cairo
8mo
Architecting, designing, and integrating PHY IP blocks for high-speed interfaces within System-on-Chip (SoC) solutions.
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Digital Design Engineer
MediaTek
Cairo
8mo
Architecture, RTL design, and integration of PHY IP blocks for SerDes and high-speed interface IP within SoCs.
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Staff Design Engineer - Video
Arm
Multiple locations
9mo
Design and test hardware modules for Image Signal Processors (ISPs), Display Processors, and Video codecs within Arm Compute Subsystems.
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SoC Power Engineer
Apple
Herzliya, Israel
9mo
Model, analyze, and estimate power consumption for daily use cases on next-generation SoCs; drive micro-architecture, design, and circuit innovations to reduce SoC power across the dynamic range.
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Digital Design Engineer
Texas Instruments
Bengaluru, Karnataka, India
9mo
Design and implementation of digital logic at the RTL level for ASICs or SoCs from specification to tape-out.
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CPU Physical Electrical Analysis Engineer
Apple
Beaverton, United States of America
9mo
Driving block and top-level design of power-grid and electrical verification closure for high performance compute blocks.
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CPU Power Engineer
Apple
Santa Clara, United States of America
9mo
Analyze and estimate power impact of micro-architectural features, generate power rollups across the design lifecycle, and identify recovery opportunities in RTL and physical implementation.
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HSI IP development engineer
MediaTek
Taipei
9mo
Developing and integrating third-party High-Speed Interface (HSI) Intellectual Property (IP) for PCIe, UCIE, and USB4 standards.
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CPU Physical Electrical Analysis Engineer
Apple
Santa Clara, United States of America
9mo
Drive block and top-level design of power-grid and analysis of high performance compute blocks in the EMIR/SIGEM/Reliability space.
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Principal Engineer, STA & Synthesis
Renesas-Electronics
Hyderabad, in
9mo
Own synthesis and timing closure sign-off for low-power, chiplet-based MCU designs on cost-optimized mature process nodes.
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Digital Design Engineer Lead (DDR5 SPD Hub)
Monolithicpower
Chengdu - China
9mo
Lead the design development, implementation, and verification of digital logic for DDR5 SPD Hub (Serial Presence Detect Hub) including register interface, control logic, security features, and I3C/I²C communication modules.
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IC Design Engineer
Silabs
Singapore
9mo
Designing digital blocks and integrating them into highly integrated mixed-signal SoCs for low-power MCU and Wireless products.
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<Data center>Senior Design Engineer - Die-to-Die Interface
MediaTek
Taipei
9mo
Develop Die-to-die and UCIe digital IP for High-Performance Computing (HPC) System-on-Chip (SOC) and integrate controllers with PHYs.
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<Data center>Senior D2D Architect
MediaTek
Taipei
9mo
Designing and optimizing die-to-die and chip-to-chip communication architectures for performance, area, power, security, and resiliency.
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RTL Design for Data Center Chassis
MediaTek
San Jose, CA
9mo
Architecting, adopting, and designing chip/chiplet chassis building blocks for data center silicon.
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<Data center>Senior Digital Design and IP Integration Engineer
MediaTek
HsinChu
9mo
Own the top-level integration of internal and third-party IPs into SOC or FPGA platforms, ensuring interface compatibility and clock/reset domain correctness.
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CPU CDC/STA Engineer
Apple
Santa Clara, United States of America
10mo
Developing, maintaining, and improving CDC, RDC, and STA constraints and methodology for CPU designs across multiple sites.
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CPU CDC/STA Engineer
Apple
Santa Clara, United States of America
10mo
Developing, maintaining, and improving CDC, RDC, and STA constraints and methodology for CPU designs across multiple design sites.
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Digital Designer_HsinChu
MediaTek
HsinChu
10mo
Designing Wi-Fi architecture, digital circuits, and SoC integration from RTL to gate level with a focus on low power and timing closure.
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GPU Physical Design Engineer
Apple
Austin, United States of America
10mo
Design and manufacture next-generation, high-performance, power-efficient GPUs for Apple devices, implementing complete chip design from RTL to tapeout.
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Principal Real Time Interconnect Architect
Arm
Multiple locations
10mo
Lead the definition and demonstration of Quality of Service (QoS) capabilities across Arm's IP portfolio and systems to ensure real-time predictability, power management, and performance.
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Design Engineer for SOC Group
Apple
Israel, Israel
10mo
Design and implement power management systems for Apple's compute SoCs, defining micro-architecture and integrating hardware into complex multi-chip systems.
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Cellular SoC Frontend STA Engineer (m/f/d)
Apple
Munich, Germany
10mo
Focal point for constraint development and design/timing analysis for Cellular SoC integration, serving as the link between digital, mixed-signal, and physical design teams.
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Staff Logic Design Engineer
Flir
US - Milpitas, CA
$142k–$142k
10mo
Architect and implement high-performance digital logic for protocol capture, analysis, and emulation in FPGA-based systems.
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PHY RTL Design Engineer
Apple
Haifa, Israel
10mo
Design and development of signal processing intensive SoCs for wireless communication, focusing on PHY layer algorithms and system design integration.
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Lead RTL Design Engineer
Cerebras
Headquarters/Sunnyvale Office
$175k–$175k
10mo
Lead RTL design engineer developing the Cerebras Wafer Scale Engine (WSE) architecture for high-performance AI training and inference.
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Senior RTL Design Engineer
Cisco
Armenia
10mo
Senior RTL Design Engineer driving next-generation silicon architecture development, defining Physical Design methodologies, and leading sub-system/SoC integration for advanced ASICs.
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Graphics FE Implementation Engineer
Apple
Austin, United States of America
10mo
Generating netlists from RTL designs for GPU implementation on Apple Silicon.
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Graphics FE Implementation Engineer
Apple
Austin, United States of America
10mo
Optimizing GPU netlists for performance, power, and area (PPA) in collaboration with RTL and physical design teams.
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Graphics FE Implementation Engineer
Apple
Austin, United States of America
10mo
Drive block-level synthesis, analysis, and optimization of GPU IP to meet timing, power, and area targets for Apple Silicon.
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Graphics FE Implementation Engineer
Apple
Santa Clara, United States of America
10mo
Drive block-level synthesis, analysis, and optimization of GPU IP to meet timing, power, and area targets for Apple Silicon.
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Graphics FE Integration Engineer
Apple
Austin, United States of America
10mo
Design and manufacture high-performance, power-efficient GPUs by integrating various IPs following architectural parameters and physical constraints.
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Graphics FE Integration Engineer
Apple
Austin, United States of America
10mo
Design and manufacture high-performance, power-efficient GPUs by integrating various IPs following architectural parameters and physical constraints.
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Graphics FE Integration Engineer
Apple
Santa Clara, United States of America
10mo
Design and manufacture high-performance, power-efficient GPU front-end RTL by integrating various IPs following architectural parameters and physical constraints.
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GPU Energy Modeling and Analysis Engineer
Apple
Santa Clara, United States of America
11mo
Design and manufacture next-generation, high-performance, power-efficient processor and system-on-chip (SoC) for Apple devices.
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GPU Energy Modeling and Analysis Engineer
Apple
Austin, United States of America
11mo
Design and manufacture next-generation, high-performance, power-efficient processor and system-on-chip (SoC) for Apple devices.
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