Analog IC Design

1,391 open positions

Application Engineer MonolithicpowerChengdu - China 1y Support new product application qualification, provide technical support for customers, and manage product technical documentation.
Principal package developing engineer MonolithicpowerChengdu - China 1y Developing new semiconductor package types, structures, and materials to meet process, reliability, and cost requirements for power delivery systems.
Senior High Speed IC Product Engineer MonolithicpowerChengdu - China 1y Develop high-speed mixed-signal ICs from initial specification to mass production, focusing on test solutions, characterization, and yield enhancement.
2026校招-Analog FAE/现场技术应用工程师轮岗项目-模拟方向 Texas InstrumentsShenzhen, Guangdong, China 1y 12-month rotational program for new FAEs to learn customer-facing technical solutions, sales processes, and systems-level design support across Field Sales, Mass Market, and Business Unit tracks.
SI/PI Senior Engineer MediaTekHsinChu 1y Senior SI/PI engineer responsible for signal integrity and power integrity design of chip, package, and PCB development for consumer, automotive, and enterprise HPC products.
Product Engineer Texas InstrumentsBengaluru, Karnataka, India 1y Design bench evaluation PCBs, debug and characterize integrated circuits, and analyze characterization data to set production test limits and predict yield.
Sr. Design Engineer MonolithicpowerDurham, NC 1y Designing analog and mixed-signal ICs for automotive power management products using sub-micron BiCMOS/DMOS technologies.
Advanced Packaging Technologist MediaTekSan Jose, CA 1y Developing innovative 2.5D/3D advanced packaging solutions for automotive, datacenter/HPC, and computing applications.
Analog Design Engineer MediaTekBangalore 1y Design and verify high-speed analog and mixed-signal blocks for SerDes architectures.
<Data center>Serdes system architecture research and development engineer MediaTekHsinChu 1y Developing high-speed SerDes system technology (200Gbps+) including electrical and optical communications, defining system specifications, and establishing simulation models.
RF Design Engineer GlobalFoundriesIND - Karnataka - Bengaluru - North 1y Design, simulation, and verification of RF circuit design blocks (LNA, PA, RF Switches, SPXTs) for silicon bring-up and characterization in advanced technologies.
Analog Design Engineer, Staff d-MatrixSanta Clara 1y Designing state-of-the-art in-memory-compute engines for AI accelerators and die-to-die serial interfaces for scale-out systems.
Senior Analog Layout Design Engineer NVIDIAIsrael, Yokneam 1y Perform physical layout for high-speed mixed-signal circuits including PLLs, SerDes, and I/O structures in sub-micron CMOS FinFET technologies.
Senior Package Design Engineer MediaTekHsinChu 1y Design and planning of various products, specifically focusing on BGA substrate layout and advanced package technology development.
Digital IC Design Engineering Intern Texas InstrumentsShanghai, Shanghai, China 1y Architect new TI products by defining, designing, modeling, implementing, and documenting analog, digital, and RF integrated circuits (ICs) across domains like audio, imaging, automotive, and power supply.
Analog IC Design Engineering Intern Texas InstrumentsShanghai, Shanghai, China 1y Architect new TI products by defining, designing, modeling, implementing, and documenting analog, digital, and RF integrated circuits (ICs) across domains like audio, imaging, automotive, and power supply.
Lead Analog Design Engineer Texas InstrumentsBengaluru, Karnataka, India 1y Lead the design, development, and verification of analog and mixed-signal circuits for embedded Flash Memory IPs, including charge pumps, voltage regulators, and sense amplifiers.
Senior substrate layout engineer MediaTekHsinChu 1y Designing advanced package BGA substrates and 2.5D IC routing (RDL & Substrate) for CoWoS and EMIB technologies.
Electrical Engineer/FPGA Designer LumentumCanada - Ottawa (Bill Leathem) 1y Design, develop, and test FPGA-based systems and electrical circuits for advanced optical metrology sensors.
Embedded Memory IP Designer MediaTekHsinChu 1y Developing memory architectures and circuit implementation techniques for Mediatek products.
Principal Design Engineer CadenceBANGALORE 1y Lead major blocks of Memory PHY layout design and perform hands-on design of critical analog and high-speed layout blocks for FinFET technology.
Design engineering Architect CadenceHYDERABAD 2y Design, simulate, and verify custom memory design blocks for memory IP, including circuit design, characterization, and silicon bring-up.
SOC On-Die Sensor Tech & Correlation Engineer MediaTekHsinChu 2y Perform pre-silicon and post-silicon correlation and modeling for adaptive voltage scaling and on-die sensors; develop and improve post-silicon testing methodologies for these areas.
Design Engineer II CadenceBANGALORE 2y Post-Silicon Physical Layer Electrical Validation for high-speed SERDES protocols.
Lead Design Engineer CadenceHYDERABAD 04 2y Develop and integrate foundry rule decks and technology files to support Process Design Kits (PDKs), ensuring physical verification and automation of design flows.
<Data center>Communication Algorithm Engineer/senior Engineer/Technical Manager MediaTekHsinChu 2y Designing communication algorithms, PHY architecture, and digital signal processing for high-speed interfaces and transceivers.
PMIC Digital IC Design Engineer MediaTekHsinChu 2y Designing power management integrated circuit (PMIC) architectures for smartphones and automotive applications, focusing on low-power techniques and mixed-signal digital IP.
Principal Design Engineer CadenceBANGALORE 2y Design major sub-systems of High-speed Memory PHYs including Tx, Rx, and Clocking.
Analog/Mixed-Signal Modeling Methodology Development Engineer MediaTekHsinChu 2y Establish, streamline, and enhance Analog/Mixed-Signal (AMS) Behavioral Modeling development methods, coding, validation processes, and integration flows to ensure high-quality silicon products.
<Data center>Die-to-Die High Speed Analog Circuit and HBM/DDRPHY Design Engineer MediaTekHsinChu 6y Design of high-speed analog PHY circuits for chip-to-chip interfaces (UCIe, Die-to-Die) and memory interfaces (HBM, DDR, LPDDR).
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System Solution Engineer - Optical Interconnect CMOS ICs for Datacom (d/m/f) Premstätten Define future optical connectivity for AI and data centers by translating customer architectures into differentiated IC product concepts and roadmaps.
IC Layout Engineer SemiAnalysisHillsboro, OR Analyze the physical design, layout, and manufacturing implementation of leading-edge integrated circuits (AI/datacenter hardware) to derive architectural and competitive insights.
VP Engineering, IC Design (On-site. West Lafayette, USA) IxanaWest Lafayette, IN Lead IC design teams to build brain-inspired wearable computing chips using patented Wi-R technology for real-time, AI-powered human-computer interaction.
Silicon Reverse Engineer SemiAnalysisHillsboro, OR Teardown and characterization of leading-edge AI and datacenter hardware (GPUs, CPUs, accelerators, memory, networking silicon) from rack to transistor to produce competitive insights and design analysis.
Staff Engineer – RF/Mixed Signal IC Design (On-site. Bengaluru, India) IxanaBengaluru, India Lead the design, tapeout, and validation of custom RF/mixed-signal silicon for next-generation brain-inspired wearables.
Staff Engineer – RF/Mixed Signal IC Design (On-site. West Lafayette, USA) IxanaWest Lafayette, IN $160k–$160k Lead the end-to-end design, verification, and integration of analog and mixed-signal IPs into Wi-R System-on-Chips (SoCs), focusing on RF IC development from architecture to post-silicon bring-up.
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Internship - Lab Verification Engineer in the AMS Lab of the Development Center Villach (f/m/div) Villach Hands-on verification of Analog-Mixed-Signal (AMS) integrated circuits using laboratory equipment and measurement techniques.
Analog/Mixed Signal IC Design Engineer (On-site. Bengaluru, India) IxanaBengaluru, India Design and analyze mixed-signal and RF circuits for low-power wireless communication in wearable computing chips.
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Principal RF Photonics Engineer (d/m/f) Premstätten Driving lab metrology and PCB design methodology for electro-optical data transmission using Photonic Integrated Circuits (PICs).
About the job SK GroupKorea Develop and validate Ruledecks for DRC/LVS/LPE using Siemens/Synopsys/Cadence tools; build verification environments and automation utilities.
Director – IC Design (On-site. Bengaluru, India) IxanaBengaluru, India Lead the vision, design, and delivery of cutting-edge silicon and high-performance mixed-signal/analog circuits for brain-inspired wearable computing products.

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