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Hardware & Physical Engineering
› Analog IC Design
Analog IC Design
1,386 open positions
Senior Mixed Signal Design Engineer
NVIDIA
US, CA, Santa Clara
$136k–$136k
8mo
Design high-speed analog and mixed-signal circuits for next-generation NVLINK interfaces, handling data rates of 25Gbps and higher from concept through silicon characterization.
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Senior Analog and Mixed Signal Engineer
NVIDIA
US, CA, Santa Clara
$168k–$168k
8mo
Design and implement high-speed interfaces and complex mixed-signal circuits for state-of-the-art GPUs using sub-micron CMOS technologies.
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Senior Engineer, Analog Circuit Design
Renesas-Electronics
Bengaluru, KA, in
8mo
Designing high-voltage power delivery products including isolated gate drivers, HV GaN power stages, and LV GaN drivers for servers, motor drives, solar inverters, and EV traction systems.
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Lead Analog SerDes Architect/Design Engineer
Intel
US, California, Santa Clara
$221k–$312k
8mo
Architecting and designing low-voltage, low-power mixed-signal integrated circuits for next-generation optical interconnects in data centers.
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<Data center>Chiplet integrator
MediaTek
HsinChu
8mo
Proposing best-fit packaging technology for chiplet integration from an architecture perspective, considering SIPI, testing, and thermal factors.
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Analog mixed signal design engineer
MediaTek
Cairo
8mo
Design and verify high-speed analog and mixed-signal blocks for next-generation wireline and optical transceivers serving data centers, cloud infrastructure, and AI/HPC.
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Senior/Staff Layout engineer
MediaTek
Cairo
8mo
Full-custom layout engineering for analog and mixed-signal IPs in next-generation wireline and optical transceivers for data centers, cloud infrastructure, and AI/HPC.
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Advanced Substrate/PCB technology Expert
MediaTek
HsinChu
8mo
Developing and enabling advanced substrate and PCB technologies for high-layer-count, ultra-large-size applications including CoWoP and DCAI, while managing vendor bring-up and technology unification.
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Senior PDK Development Engineer
Analogdevices
Ireland, Limerick
8mo
Develop, maintain, and validate Process Design Kits (PDKs) representing semiconductor process technologies for internal and external foundries.
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Engineer, Product & System Engineering (Media Health Manufacturing), Heterogenous Integration - High Bandwidth Memory
Micron
Fab 10A, Singapore
9mo
Developing, validating, and qualifying next-generation High Bandwidth Memory (HBM) products to ensure reliability, optimize manufacturing test flows, and improve yield for DRAM, interface, and stacked die architectures.
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Senior/Principal Analog & Mixed Signal Design Engineers
Lumilens
San Jose
9mo
Design and deliver high-performance Driver and TIA circuits in BiCMOS and advanced semiconductor nodes for chip-to-chip optical interconnects.
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Photonics Layout and Design Automation Engineer
Aeva
Mountain View, CA
9mo
Develop CAD infrastructure and automation tools for silicon photonics chip design, integrating simulation, layout, and physical verification to support 4D LiDAR sensor development.
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System Engineer
Texas Instruments
Bengaluru, Karnataka, India
9mo
Define product roadmaps and technical specifications for RF clock synthesizers, buffers, and BAW oscillators, bridging customer needs with engineering execution.
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Senior PDK Engineer
MediaTek
HsinChu
9mo
Design enablement for advanced process and package (3DIC, CoWoS) PDK and RC extraction development.
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Wireline Serdes Analog Mixed Signal Design Engineer
MediaTek
Irvine, CA
9mo
Design and verification of high-speed analog and mixed signal circuits for next-generation wireline and optical transceivers serving data centers, cloud infrastructure, and AI/HPC.
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Senior Staff/Staff Power Integrity Engineer
MediaTek
San Jose, CA
9mo
Design and analysis of Power Delivery Networks (PDNs) for data center System-on-Chips (SoCs), encompassing voltage regulators, PCBs, substrates, and silicon dies.
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<Data center>Senior Signal and Power Integrity Engineer
MediaTek
HsinChu
9mo
Lead technical efforts in Power Integrity (PI) and Signal Integrity (SI) signoff, modeling, and optimization for high-speed IO interfaces and power delivery networks across package, PCB, die, interposer, and substrate designs.
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Staff Digital Design Engineer
ON Semiconductor
Brno, South Moravia, Czech Republic
9mo
Design and verify analog and mixed signal circuits for market-leading driver devices and solutions.
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Application Simulation Engineer
Monolithicpower
Hangzhou - China
9mo
Build simulation models and validation plans for integrated power semiconductor products to support new product development and field applications.
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Senior Mixed-Signal Analog CAD Engineer
NVIDIA
Israel, Yokneam
10mo
Develop and maintain in-house EDA solutions for schematic, layout, package, and physical verification of high-speed mixed-signal circuits.
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Trainee - Electronic Design Automation in Microelectronics
GlobalFoundries
Sofia
10mo
Development and verification of Design Kits for CMOS, RFCMOS, and BiCMOS processes to support integrated circuit design and manufacturing.
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Analog Field Applications Engineer (Penang, Malaysia)
Texas Instruments
Malaysia
10mo
Partnering with sales to provide analog technical expertise, solve customer projects, and create new functionality/opportunities throughout the sales cycle.
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Design Engineer (New Grad)
Monolithicpower
Taipei - Taiwan
10mo
Designing analog and mixed-signal ICs for Power Management Products using sub-micron BiCMOS/DMOS technologies.
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Sr./Staff Design Engineer (ACDC) (Taipei/Hsinchu)
Monolithicpower
Hsinchu - Taiwan
10mo
Design analog and mixed-signal ICs for power management products focusing on AC-DC and lighting applications.
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Senior Design Engineer (Automotive)
Monolithicpower
Chengdu - China
10mo
Design, layout, simulation, and validation of analog and mixed-signal power semiconductor ICs for automotive and industrial applications.
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Staff / Principal Engineer - NAND FA
Micron
Hyderabad - Phoenix Aquila, India
11mo
System-level integration and failure analysis for non-volatile memory products (SSD, UFS, uSD), bridging NAND component development with system requirements.
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Principal Design Engineer
Cadence
CORK 01
11mo
Lead Analog and Mixed Signal design of high-speed memory interface analog components for state-of-the-art DDR memory interface PHYs in leading edge technology nodes.
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Staff Product Engineer
ON Semiconductor
Allen, TX, United States
11mo
Design and productize deep analog and mixed-signal test solutions (DfT, BIST) for semiconductor devices targeting Automotive and Industrial markets.
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Optical Design Engineer
Lumilens
Singapore
11mo
Design and verify coupling optics for silicon photonics electro-optical components to deliver optical signals up to 1.6 Tb/s into customer networks.
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Sr./Staff Design Engineer (DCDC) (Taipei/Hsinchu)
Monolithicpower
Taipei - Taiwan
11mo
Designing mixed-signal power management ICs including DCDC converters, load switches, and related topologies for storage and enterprise power solutions.
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Advanced packaging technology development engineer/ manager
MediaTek
HsinChu
11mo
Developing advanced packaging technologies for new product introductions, focusing on chiplet and 3DIC structures.
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IP DFT Engineer
MediaTek
Austin, TX
11mo
Developing and implementing Design for Test (DFT) strategies for mixed-signal IP blocks to ensure high test coverage and manufactability.
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Senior Principal Analog Design Engineer
ON Semiconductor
Brno, South Moravia, Czech Republic
11mo
Define, design, and validate cutting-edge analog-digital integrated circuits, specifically power management ICs, from architecture to production.
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Principal Technology Development Engineer
Monolithicpower
San Jose, CA
$140k–$140k
11mo
Developing and maintaining power IC devices and processes for integrated power semiconductors.
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Senior Principal Digital Design Engineer
ON Semiconductor
Brno, South Moravia, Czech Republic
11mo
Define, design, and validate cutting-edge analog-digital integrated circuits, specifically high-performance sensor interfaces, drivers, and communication circuits for the automotive industry.
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Lead Digital Design Engineer
ON Semiconductor
Brno, South Moravia, Czech Republic
11mo
Lead the end-to-end development of high-performance analog-digital integrated circuits, specifically sensor interfaces and drivers for the automotive industry.
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Digital Design Director
ON Semiconductor
Brno, South Moravia, Czech Republic
11mo
Managing a team of digital designers to define, design, and validate cutting-edge analog-digital integrated circuits for high-performance sensor interfaces, drivers, and communication circuits in the automotive industry.
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2026 Field Applications Program
Texas Instruments
Taiwan
1y
12-month rotational program training rising Field Applications Engineers (FAEs) to solve customer design challenges and maximize revenue through systems-level solutions.
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Engineer / Staff Engineer - Sensor Circuit Design for Advanced Technology Node
MediaTek
Singapore
1y
Designing complex circuit blocks and standard cell libraries for leading-edge process nodes (planar, FinFET, nanosheet) and developing advanced library generation methodologies.
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Sr. Layout Engineer
Monolithicpower
Taipei - Taiwan
1y
Developing Mixed-Signal and Analog Integrated Circuits through layout design, device placement, and tapeout execution.
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Principal High Speed Clocking Design Engineer
Monolithicpower
Chengdu - China
1y
Lead high-speed analog/mixed-signal circuit design for memory product IPs (DDR, LPDDR), focusing on critical clocking blocks and data path specifications.
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Layout Engineer (New Grad)
Monolithicpower
Taipei - Taiwan
1y
Develop Mixed-Signal and Analog Integrated Circuits by performing device placement, block implementation, and tapeout.
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Analog IC Design Lead (OLED Driver)
Monolithicpower
1y
Lead IC design for OLED driver circuits, managing the full flow from specification and block partitioning to transistor-level design, layout supervision, and silicon validation.
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Senior/Staff Analog Designer (Digital Isolator)
Monolithicpower
1y
Design and develop high-performance analog circuits, specifically digital isolators, for various applications.
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Package and Chip thermal/stress simulation engineer
MediaTek
HsinChu
1y
Performing thermal and stress simulation analysis for IC packages, boards, and system-level designs to ensure reliability under various conditions.
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Senior High Speed IC Product Engineer
Monolithicpower
Chengdu - China
1y
Develop high-speed mixed-signal ICs from initial specification to mass production, focusing on test solutions, characterization, and yield enhancement.
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Application Engineer
Monolithicpower
Chengdu - China
1y
Support new product application qualification, provide technical support for customers, and manage product technical documentation.
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Principal package developing engineer
Monolithicpower
Chengdu - China
1y
Developing new semiconductor package types, structures, and materials to meet process, reliability, and cost requirements for power delivery systems.
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2026校招-Analog FAE/现场技术应用工程师轮岗项目-模拟方向
Texas Instruments
Shenzhen, Guangdong, China
1y
12-month rotational program for new FAEs to learn customer-facing technical solutions, sales processes, and systems-level design support across Field Sales, Mass Market, and Business Unit tracks.
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SI/PI Senior Engineer
MediaTek
HsinChu
1y
Senior SI/PI engineer responsible for signal integrity and power integrity design of chip, package, and PCB development for consumer, automotive, and enterprise HPC products.
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