【Welcome New Grads】Package/System Design Solutions Engineer - Engineer / Sr. Engineer
Core
Architecting, designing, and verifying IC package products (Digital, RF, Analog, PMIC) with system-level co-design of IC-PKG-PCB to optimize performance, cost, and thermal constraints.
Role type
Senior IC Package System Design Engineer
Builds
Qualcomm package products (Digital, RF, Analog, PMIC)
Domain
Semiconductor / Hardware Engineering
Required skills
IC package design, PCB design, system-level co-design, signal integrity analysis, power distribution network (PDN) design, thermal management, IC floor-planning, bump pattern assignment, electromagnetic (EM) simulation, impedance control, cross-talk analysis, die-to-package-to-board optimization
Preferred skills
Pinmap optimization, 3D/2D EM simulation tools, transmission line theory, substrate manufacturing processes, PCB stack-up strategy, competitive analysis, road mapping
Technologies
EM simulation tools, PCB design tools, IC design tools
Responsibilities
Perform IC top-level floorplanning including macro block placement, padring, RDL, and bump pattern assignment; Develop system-level co-design methodology for IC, Package, and PCB; Conduct concept analysis for new product package selection based on mechanical, thermal, and electrical performance; Implement package design flow for high-speed interface SI constraints and PDN constraints for high-frequency processor cores; Collaborate with marketing and product teams on competitive analysis and road mapping.
Seniority
Senior, hands-on IC
