CareerPlan

Pathfinding Device Integration Engineer

Boise, Idaho, United States of AmericaFull-time2026-07-28 → 2026-10-20

Core

Drive early-stage technology development by connecting device physics, materials science, and process integration to advance device scaling, performance, and manufactability.

Role type

Senior IC device integration engineer (semiconductor R&D)

Builds

Next-generation memory solutions and scalable technologies

Domain

Semiconductor industry, memory and storage

Required skills

semiconductor device physics, process integration, experimental design, data analysis, technology trade-off assessment

Preferred skills

advanced semiconductor nodes, emerging device architectures, semiconductor processing, TCAD, physics-based modeling, AI-assisted analytics

Technologies

TCAD, physics-based modeling tools, statistical analysis tools

Responsibilities

Evaluate novel device concepts, material systems, and integration schemes; Lead process integration efforts; Design and implement experiments in the R&D fab; Analyze inline, parametric, and probe data; Collaborate with modeling, characterization, reliability, and device teams

Seniority

Senior, hands-on IC