HBM Architect
Core
Establishing technical engagement with US customers to address base-die architectural challenges in HBM and 3D-stacked DRAM, while building a focused design team and developing advanced customized HBM architectures.
Role type
Senior IC HBM Architect
Builds
HBM and 3D-stacked DRAM architectures and circuits
Domain
Semiconductor memory (DRAM/HBM)
Deliverable
production ML models | product features
Required skills
DRAM/HBM architecture design, Full Custom + Digital Co-Design, PDN analysis, Logic Foundry design, failure analysis tools, circuit design for DRAM/HBM
Preferred skills
HBM product assembly system analysis, Full Custom Design at advanced process nodes (DRAM 1x nm, Foundry 3nm or below), Python, Spotfire, Verilog, Circuit Simulators (Hspice, Csim, PrimeSim, Spectre)
Technologies
Hspice, Csim, PrimeSim, Spectre, Verilog, Python, Spotfire
Responsibilities
Design circuits for DRAM and HBM products meeting specifications; Improve design quality and yield during product development; Perform characteristic analysis and verify specifications at Wafer, KGSD, and Assembly stages; Enhance performance and ensure stable operation to meet customer requirements
Seniority
Senior, hands-on IC