Principal SI/PI Design Engineer
Core
Lead electrical package design for custom in-house photonic, analog, and digital ICs supporting next generation optical modules.
Role type
Principal IC Package Design Engineer
Builds
Custom photonic, analog, and digital IC packages for optical modules
Domain
Semiconductor / High-speed connectivity / Optical modules
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
IC package design, BGA configuration, package structure design, layout optimization, design verification, tapeout, cross-functional coordination, silicon floor planning, bump design, package pin-out, signal integrity (SI) simulation, power integrity (PI) simulation, RF performance optimization, vendor management, substrate design, 2.5-D/3-D IC interposer knowledge
Preferred skills
Advanced Package Designer (APD), Xpedition Package Designer (XPD), SIWave, HFSS, package design electrical review, manufacturing review
Technologies
Cadence APD, Cadence XPD, SIWave, HFSS
Responsibilities
Own and drive advanced package selection and new product BGA configuration; perform package/SIP layout, optimization, design verification, and tapeout; interface with cross-functional groups for feasibility analysis; optimize silicon floor plan, bump, and package pin out; simulate and optimize SI/PI and RF performance; coordinate with CMs and vendors for design sourcing and development
Seniority
Principal, hands-on IC
