Advanced Packaging & Integration Engineer
Core
Advanced packaging technology development engineer focused on silicon photonic packaging and electronic-photonic integration, including 2.5D/3D chip stacking, heterogeneous integration, and ultra-fine pitch interconnect technologies.
Role type
Senior IC advanced packaging engineer (silicon photonics)
Builds
Robust packaging solutions for high density photonics integration, CPO, and on-board optics
Domain
Semiconductor manufacturing / Silicon Photonics / Advanced Packaging
Deliverable
production ML models | product features
Required skills
Advanced packaging technology, Heterogeneous integration, Ultra-fine pitch interconnects, Wafer processing, Fine pitch bumping, D2W/W2W hybrid bonding, Fanout, Advanced substrate development, Design for Manufacturability (DfM), Design for Reliability (DfR), Root cause analysis, CAD tools (kLayout, APD, Solidworks)
Preferred skills
Physical failure analysis, Thin die/wafer processing, Finite element analysis, Next-generation substrate and PCB design, Si photonic co-integration (CPO, NPO)
Technologies
kLayout, APD, Solidworks
Responsibilities
Drive definition, design and analysis of packaging technology test vehicles; Validate new technology against key performance metrics; Oversee wafer processing and assembly processes; Work with foundry and assembly partners to qualify packaging solutions; Guide DfM and DfR; Identify and mitigate complex packaging risks.
Seniority
Senior, hands-on IC