Advanced Packaging Modeling Engineer
Core
Mechanical, thermal, or electrical modeling engineer optimizing 3DHI and advanced packaging for logic, RF, analog, and memory technologies.
Role type
Senior IC modeling engineer (advanced packaging)
Builds
Device, integration, and 3DHI advanced packaging optimizations
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features
Required skills
Semiconductor mechanical/thermal/electrical simulation, Ansys Mechanical Workbench, semiconductor process integration, stress simulation, commercial simulation software
Preferred skills
RF analog circuit design simulation, LVS/DRC verification tools (Cadence/Mentor Graphics/Keysight ADS), project management, leadership
Technologies
Ansys Mechanical Workbench, Cadence, Mentor Graphics, Keysight ADS
Responsibilities
Perform stress simulations for continuous and discontinuous active areas; anticipate integration/process issues based on team inputs; facilitate discussions to identify critical process interactions; apply simulation software to mimic semiconductor process flows; interact with integration, device, and design engineers to develop working technology
Seniority
Senior, hands-on IC
