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Hardware & Physical Engineering
› ASIC Physical Design
ASIC Physical Design
2,685 open positions
Senior Principal ASIC Design Engineer
Asteralabs
Germany
3mo
Senior technical leader driving ASIC design for next-generation Ethernet and Scale-Up (ESUN) connectivity products for rack-scale AI infrastructure.
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GPU System Integration Engineer
MediaTek
HsinChu
3mo
RTL platform design integration including clock, reset, power, bus design, architecture, and MBIST for FPGA and Emulator.
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Technical Manager of Digital Design
MediaTek
HsinChu
3mo
Define hardware architecture of digital IP/systems and lead digital circuit design for 4/5/6G modem hardware.
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Senior Memory System Architect
NVIDIA
US, CA, Santa Clara
$152k–$242k
3mo
Designing and optimizing memory system architecture and micro-architecture for NVIDIA's System-on-Chip (SoC) solutions used in deep-learning, autonomous vehicles, robotics, mobile, server, and gaming systems.
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Senior Digital Design Engineer
MediaTek
HsinChu
3mo
Design and optimize digital hardware platforms for 4/5/6G modems, focusing on PPA (Power, Performance, Area) and subsystem integration.
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Smartphone SoC System Architect
MediaTek
HsinChu
3mo
Lead SoC architecture design, modeling, and technical feasibility studies for smartphone and connectivity products.
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SOC Clocks RTL Design Engineer
NVIDIA
Israel, Tel Aviv
3mo
Own the SOC clocking logic end-to-end for next-generation networking chips, translating micro-architecture specs into synthesizable RTL and driving it to silicon.
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SystemC Modeling Developer (Remote)
↗
Ust
Remote
3mo
Design and develop SystemC/TLM models for next-generation Compute and AI server platforms to enable architecture exploration, performance analysis, and pre-silicon software development.
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SOC Clocks RTL Design Engineer
NVIDIA
Israel, Tel Aviv
3mo
Own the SOC clocking logic end-to-end for next-generation networking chips, translating micro-architecture specs into synthesizable RTL and driving designs to silicon.
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Senior SOC Clocks RTL Design Engineer
NVIDIA
Israel, Tel Aviv
3mo
Technical lead for clocking logic development on next-generation networking System-On-Chip (SOC), responsible for PLL integration, clock generation, distribution, and domain crossing.
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Senior SOC Clocks RTL Design Engineer
NVIDIA
Israel, Tel Aviv
3mo
Technical lead for clocking logic development on next-generation networking System-On-Chip (SOC), responsible for PLL integration, clock generation, distribution, and domain crossing.
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Principal Subsystem Engineer (Design or DV)
Microsoft
United States, California, Mountain View
3mo
Lead the design or design verification of complex, high-performance custom IP and System on Chip (SoC) subsystems, focusing on AI/ML SoCs and delivering silicon from concept through bring-up.
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Principal Subsystem Design Manager
Microsoft
United States, California, Mountain View
3mo
Lead the design of premium-quality custom Intellectual Property (IP) and System on Chip (SoC) subsystems, focusing on architectural and micro-architectural functions for high-performance, efficient execution.
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Hardware Engineer
Western-Digital
San Jose, CA, us
3mo
Design custom silicon, electronic hardware, embedded firmware, and mechanical systems for next-generation hard disk drives and data storage products.
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Senior Silicon Engineer
Microsoft
India, Karnataka, Bangalore
3mo
Own block-level DFT architecture, specifications, and implementation for logic and memory test solutions, driving timing closure and signoff across Scan, MBIST, LBIST, IJTAG, and in-system test modes.
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Physical Design Engineer
NVIDIA
Israel, Tel Aviv
3mo
Physical design of high-speed communication blocks targeting optimal power, area, and performance within challenging constraints.
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Circuit Design Engineer - Standard Cell
NVIDIA
US, CA, Santa Clara
$116k
3mo
Designing transistor-level standard cell libraries and custom ROM modules for advanced GPU and accelerator architectures.
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SRAM Circuit Design Engineer
Apple
Beaverton, United States of America
3mo
Design and implement custom digital SRAM circuits for Apple's high-performance silicon products (M1, A14 Bionic, etc.), optimizing for power, timing, area, and yield.
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Senior Physical Design Interposer Engineer
NVIDIA
US, CA, Santa Clara
$136k
3mo
Build automated flows, methodologies, and tools to construct, analyze, and validate complex interposer designs for NVIDIA's multi-die platforms.
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Video Codec Design Engineer, up to Staff
Qualcomm
Taipei, Taipei City, Taiwan
3mo
Architect and develop advanced video encoder and decoder hardware for high performance, low power semiconductor products.
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Physical Design Engineer, Synthesis and Implementation
NVIDIA
US, MA, Westford
$116k–$190k
3mo
Own RTL-to-gate synthesis and QoR convergence for complex digital blocks and hierarchical partitions while supporting physical implementation from floorplanning through routing and timing closure.
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SRAM Circuit Design Engineer
Apple
Santa Clara, United States of America
3mo
Design and implement custom digital SRAM circuits for Apple's high-performance silicon products (M1, A14 Bionic) serving CPUs, GPUs, and SoCs.
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Senior ASIC Verification Engineer - PMU
NVIDIA
China, Shanghai
3mo
Architect and implement the micro-architecture for the next generation Power Management Unit (PMU) IP, which includes a RISC-V core and custom control logic, to optimize chip performance and efficiency for AI datacenter applications.
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Senior ASIC Verification Engineer - PMU
NVIDIA
China, Shanghai
3mo
Architecting next-generation PMU (Power Management Unit) IP for AI datacenter chips, focusing on power efficiency optimization across idle and active scenarios.
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HBM SoC RTL Design Engineer
Micron
Folsom, California, United States of America
$121k
3mo
Design, develop, and integrate next-generation HBM SoC logic die, implementing RTL for SoC-level blocks and subsystems.
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Principal Engineer Digital Design (f/m/div)
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Infineon Technologies
Cork, County Cork, Ireland
3mo
Lead architecture and implementation of complex digital and mixed-signal blocks for automotive microcontroller IPs, ensuring safety compliance and driving scalable, reusable IP development.
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SoC Design and Integration Engineer
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Qualcomm
Tijuana, Baja California, Mexico
3mo
Design and integration of high-performance System-on-Chip (SoC) architectures for mobile, AI, Compute, and XR applications using sub-5nm process nodes.
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Principal Digital Design Engineer
Analogdevices
Germany, Munich, Seidlstr
3mo
Lead digital RTL development and architecture for complex digital controllers in power management ICs (PMICs) and mixed-signal ICs using FinFast™ technology.
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Principal SoC I/O Performance Architect
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AMD
Vancouver, British Columbia, Canada
3mo
Define and optimize I/O performance (bandwidth, latency, QoS) for next-generation SoCs using modeling, simulation, and post-silicon analysis to drive architecture decisions.
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SRAM Circuit Design Engineer
Apple
Austin, United States of America
3mo
Design and implement custom digital SRAM circuits for high-performance silicon chips (CPU/GPU/SoC) serving Apple's flagship products.
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Datacenter Compute Accelerator Architect
MediaTek
San Jose, CA
3mo
Lead the design and integration of dedicated hardware accelerators (crypto, compression, DMA, tensor cores) within next-generation data center silicon to maximize system-level performance and efficiency for hyper-scale cloud environments.
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RTL integration Engineer
Broadcom
USA-CA San Jose Innovation Drive
$144k
3mo
Perform IP integration, test/debug mode verification, and RTL design creation at the SoC level.
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ASIC Engineer
Cisco
Hsinchu, Taiwan
3mo
Define, design, and verify high-performance ASIC and subsystems for Cisco platforms, focusing on power, performance, and area goals.
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Enterprise Hardware Engineering Technical Lead
Cisco
RTP, North Carolina, US
$139k
3mo
Hardware board and system design engineer responsible for the full lifecycle of Cisco's Edge and Access routing products, from architecture and design through bring-up, validation, and production readiness.
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Lead CPU Power and Performance Architect
Advanced Micro Devices, Inc
Santa Clara, California
3mo
Lead PPA Architect ensuring CPU Core & Cache complexes for embedded products meet performance requirements within reliability, power delivery, and thermal constraints.
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Senior Design Engineer
Microsoft
United States, California, Mountain View
3mo
Designing high-performance, high-bandwidth Network-on-Chip (NoC) and AI SoC microarchitectures, including RTL design, synthesis, and SOC integration.
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Silicon Design Engineer
Advanced Micro Devices, Inc
San Jose, California
3mo
Lead and contribute to the design, integration, verification, and characterization of advanced silicon testchips supporting FPGA and ASIC products on leading-edge process technologies.
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Principal DFT Engineer (Silicon Engineering)
SpaceX
Austin - 800
3mo
Lead implementation and optimization of DFT architectures for next-generation ASICs deployed in space and ground infrastructures to enable global connectivity.
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ASIC Physical Design Engineer
Janestreet
London
3mo
Design, test, and deploy advanced hardware for ultra low latency trading, networking, and research infrastructure.
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ASIC Physical Design Engineer
Janestreet
New York
3mo
Design, test, and deploy advanced hardware for an ultra low latency team, collaborating across trading, networking, and research infrastructure.
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Hardware Engineer
Janestreet
New York
3mo
Design and implement FPGA or ASIC applications using high-level hardware description languages and tools.
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ASIC Engineer
Janestreet
New York
3mo
Design, test, and deploy advanced hardware designs for ultra low latency systems, working on both FPGA and ASIC technologies.
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Hardware Engineer (FPGA/ASIC)
Janestreet
New York
3mo
Intern role focused on using programming language technology (OCaml/Hardcaml) to improve the design, testing, and validation of hardware systems.
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Lead Power and Performance Attainment Engineer
Advanced Micro Devices, Inc
Bangalore, India
3mo
Drive power-constrained performance attainment for AMD Instinct AI/ML/HPC accelerators from pre-Si modeling to post-Si validation.
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ASIC Digital Design Engineer Lead
Apple
Cupertino, United States of America
3mo
Lead digital design engineering for custom silicon (display) across iPhone, iPad, and AppleTV, collaborating with internal teams and external vendors to define, develop, and productize next-generation devices.
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AI/ML Driven ASIC Design and Implementation Automation Engineer
Nxp
San Diego (Treena St)
$148k
3mo
Develop prototype AI/ML solutions to automate and optimize SoC and IP development flows for automotive processors and microcontrollers.
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Integration Engineer
Apple
Santa Clara, United States of America
3mo
Integrate third-party or internal IP blocks into System-on-Chip (SoC) designs and manage RTL codebases to deliver Apple hardware products.
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Staff Digital Design Engineer
Nxp
Bangalore
3mo
Lead architecture, implementation, and integration of digital subsystems for Automotive Ethernet PHY products (10BASE‑T1S, 100BASE‑T1, 1000BASE‑T1, and multi‑gig automotive SerDes technologies), driving digital micro-architecture, state machines, PCS…
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Senior Physical Design Methodology Engineer, Innovus Flows
NVIDIA
US, CA, Santa Clara
$168k
3mo
Developing innovative physical design methodologies for GPU, CPU, Network processors, and SOC implementation to optimize PPA (Power, Performance, Area) and runtime on advanced technology nodes.
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ASIC Digital Design Engineer Lead
Apple
San Diego, United States of America
3mo
Lead ASIC digital design efforts for custom silicon (displays) in mobile products, collaborating with internal teams and external vendors to define, develop, and productize next-generation devices.
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