SiP System and Design Architect (m/f/d)
Core
Translating product requirements into executable SiP functional architectures, chip/chiplet partitions, and package-level design concepts for automotive electronics.
Role type
Senior IC System-in-Package (SiP) System and Design Architect
Builds
System-in-Package (SiP) architectures, chiplet partitions, and package-level designs for automotive systems
Domain
Automotive electronics, Semiconductor design, System-in-Package (SiP)
Required skills
SiP architecture, Chip/chiplet partitioning, SystemC modeling, Transaction-Level Modeling, High-speed die-to-die interfaces (UCIe), Package electrical design, Functional safety, Cybersecurity interfaces, Design for test/manufacturability/reliability, System-level test requirements
Preferred skills
Package/substrate floorplanning, Design-rule handover, Automotive electronics test concepts, German language
Technologies
SystemC, Transaction-Level Modeling, UCIe, EDA tools
Responsibilities
Translating requirements into SiP architectures and chiplet partitions, Defining die-to-die communication and substrate electrical architecture, Creating virtual architecture models for performance assessment, Coordinating cross-domain alignment between system, silicon, software, and package stakeholders, Developing architecture concepts for boot, power management, and functional safety, Defining design for test and manufacturability requirements, Maintaining architecture specifications and design guidelines
Seniority
Senior, hands-on IC
