SiP System and Design Architect (m/f/d)
Core
Translating product requirements into executable SiP functional architectures, chip/chiplet partitions, and package-level design concepts for automotive electronics.
Role type
Senior IC system-in-package (SiP) system and design architect
Builds
System-in-Package (SiP) solutions, chiplet partitions, and package-level designs for software-defined vehicles
Domain
Automotive electronics, semiconductor design, System-in-Package (SiP)
Required skills
SiP functional architecture, chip/chiplet partitioning, die-to-die communication, substrate electrical architecture, SystemC modeling, Transaction-Level Modeling, high-speed interface protocols (UCIe), package floorplanning, design for test/manufacturability/reliability
Preferred skills
Package/substrate floorplanning, electrical package design, design-rule handover, automotive electronics test concepts, requirements engineering
Technologies
SystemC, Transaction-Level Modeling, UCIe, EDA tools
Responsibilities
Translating requirements into SiP architectures, defining die-to-die interfaces, creating virtual architecture models, coordinating cross-domain trade-offs, maintaining architecture specifications and design guidelines
Seniority
Senior, hands-on IC
