PCB and Package Design Engineer for SoC Products
Core
Lead PCB and Package design for System-on-Chip (SoC) products targeting industrial equipment and physical AI applications, ensuring system-level feasibility and optimization.
Role type
Senior IC PCB and Package Design Engineer
Builds
High-performance SoC products for robotics, machine vision, and autonomous control systems
Domain
Semiconductor / Hardware Engineering / Physical AI
Required skills
Cadence PCB and Package design, Ansys electromagnetic analysis, SPICE circuit simulation, Signal Integrity (SI) analysis, Power Integrity (PI) analysis, High-speed memory interface design (DDR4/5, LPDDR4/5), High-speed interface design (PCIe, USB 3.x, Ethernet PHY), Multi-pin FCBGA/Wire Bond BGA/QFN/WLCSP design, RDL design
Preferred skills
Altium Designer PCB design, Siemens HyperLynx analysis, RF SoC design, 3D electromagnetic analysis, EMC analysis, Global cross-functional collaboration
Technologies
Cadence, Ansys, SPICE, Altium Designer, Siemens HyperLynx, DDR4/5, LPDDR4/5, PCIe, USB 3.x, Ethernet PHY, FCBGA, BGA, QFN, WLCSP, RDL
